16-BIT, 50MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM, GREEN, PLASTIC, BGA-256
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, |
| 针数 | 256 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
| 地址总线宽度 | 13 |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B256 |
| 长度 | 17 mm |
| 低功率模式 | YES |
| 端子数量 | 256 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.05 mm |
| 最大供电电压 | 1.32 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 宽度 | 17 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS320C6747ZKBT3 | TMS320C6747ZKBT2 | TMS320C6747ZKB3 | TMS320C6745PTPT2 | TMS320C6745PTPT3 | |
|---|---|---|---|---|---|
| 描述 | 16-BIT, 50MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM, GREEN, PLASTIC, BGA-256 | IC 16-BIT, 50 MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM, GREEN, PLASTIC, BGA-256, Digital Signal Processor | 16-BIT, 50MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM, GREEN, PLASTIC, BGA-256 | 8-BIT, 50MHz, OTHER DSP, PQFP176, 24 X 24 MM, 0.50 MM, PLASTIC, HLQFP-176 | 8-BIT, 50MHz, OTHER DSP, PQFP176, 24 X 24 MM, 0.50 MM, PLASTIC, HLQFP-176 |
| 零件包装代码 | BGA | BGA | BGA | QFP | QFP |
| 包装说明 | BGA, | BGA, | BGA, | HLFQFP, | HLFQFP, |
| 针数 | 256 | 256 | 256 | 176 | 176 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
| 地址总线宽度 | 13 | 13 | 13 | 13 | 13 |
| 桶式移位器 | NO | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 8 | 8 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PQFP-G176 | S-PQFP-G176 |
| 长度 | 17 mm | 17 mm | 17 mm | 24 mm | 24 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 端子数量 | 256 | 256 | 256 | 176 | 176 |
| 最高工作温度 | 105 °C | 105 °C | 70 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | HLFQFP | HLFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.05 mm | 2.05 mm | 2.05 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
| 最小供电电压 | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 1 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD |
| 宽度 | 17 mm | 17 mm | 17 mm | 24 mm | 24 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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