D/A Converter, 1 Func, Parallel, Word Input Loading, PDSO20, 0.300 INCH, SO-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 20 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY, 2\'S COMPLEMENT BINARY |
输入格式 | PARALLEL, WORD |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
长度 | 12.8 mm |
最大线性误差 (EL) | 0.0122% |
湿度敏感等级 | 1 |
位数 | 12 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 245 |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.5 mm |
MX7545AKEWP | MX7545AKN | MX7545AKCWP | MX7545AKEWP-T | MX7545ALP | |
---|---|---|---|---|---|
描述 | D/A Converter, 1 Func, Parallel, Word Input Loading, PDSO20, 0.300 INCH, SO-20 | D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | D/A Converter, 1 Func, Parallel, Word Input Loading, PDSO20, 0.300 INCH, SO-20 | D/A Converter, 1 Func, Parallel, Word Input Loading, PDSO20, 0.300 INCH, SO-20 | D/A Converter, 1 Func, Parallel, Word Input Loading, PQCC20, PLASTIC, LCC-20 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | SOIC | DIP | SOIC | SOIC | QLCC |
包装说明 | SOP, | DIP, | SOP, | SOP, | QCCJ, |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | S-PQCC-J20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 12.8 mm | 26.16 mm | 12.8 mm | 12.8 mm | 8.965 mm |
最大线性误差 (EL) | 0.0122% | 0.0122% | 0.0122% | 0.0122% | 0.0122% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | SOP | SOP | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
峰值回流温度(摄氏度) | 245 | 245 | 245 | 245 | 245 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | 4.572 mm | 2.65 mm | 2.65 mm | 4.57 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | J BEND |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | 8.965 mm |
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