SPECIALTY MICROPROCESSOR CIRCUIT, PQCC16
专业微处理器电路, PQCC16
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大工作温度 | 85 Cel |
| 最小工作温度 | -40 Cel |
| 最大供电/工作电压 | 5.5 V |
| 最小供电/工作电压 | 2.3 V |
| 额定供电电压 | 2.5 V |
| 加工封装描述 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT629-1, HVQFN-16 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | ACTIVE |
| 包装形状 | SQUARE |
| 包装尺寸 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 表面贴装 | Yes |
| 端子形式 | NO LEAD |
| 端子间距 | 0.6500 mm |
| 端子涂层 | NICKEL PALLADIUM GOLD |
| 端子位置 | QUAD |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | INDUSTRIAL |
| 微处理器类型 | MICROPROCESSOR CIRCUIT |
| PCA9541PW/03/G,118 | PCA9541PW/01,112 | PCA9541PW/02,112 | PCA9541D/03,112 | PCA9541D/01,112 | PCA9541D/02,112 | |
|---|---|---|---|---|---|---|
| 描述 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC16 | SPECIALTY MICROPROCESSOR CIRCUIT, PDSO16 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC16 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC16 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC16 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC16 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 表面贴装 | Yes | YES | Yes | YES | YES | YES |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Brand Name | - | NXP Semiconduc | - | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 厂商名称 | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | - | TSSOP | - | SOP | SOP | SOP |
| 包装说明 | - | TSSOP, TSSOP16,.25 | - | 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16 | 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16 | 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16 |
| 针数 | - | 16 | - | 16 | 16 | 16 |
| 制造商包装代码 | - | SOT403-1 | - | SOT109-1 | SOT109-1 | SOT109-1 |
| Reach Compliance Code | - | compli | - | unknow | unknow | unknow |
| JESD-30 代码 | - | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | - | e4 | e4 | e4 |
| 长度 | - | 5 mm | - | 9.9 mm | 9.9 mm | 9.9 mm |
| 最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | - | SOP | SOP | SOP |
| 封装等效代码 | - | TSSOP16,.25 | - | SOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | 260 | - | 260 | 260 | NOT SPECIFIED |
| 电源 | - | 2.5/5 V | - | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.1 mm | - | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大压摆率 | - | 0.6 mA | - | 0.6 mA | 0.6 mA | 0.6 mA |
| 最大供电电压 | - | 5.5 V | - | 5.5 V | 5.5 V | 3.6 V |
| 最小供电电压 | - | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 | - | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS |
| 端子面层 | - | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子节距 | - | 0.65 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | - | 30 | - | 30 | 30 | NOT SPECIFIED |
| 宽度 | - | 4.4 mm | - | 3.9 mm | 3.9 mm | 3.9 mm |
| uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR CIRCUIT | - | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
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