HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16
HCT系列, 8 线 TO 1 线 多路复用器, 互补输出, PDSO16
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大工作温度 | 125 Cel |
| 最小工作温度 | -40 Cel |
| 最大供电/工作电压 | 5.5 V |
| 最小供电/工作电压 | 4.5 V |
| 额定供电电压 | 5 V |
| 加工封装描述 | SSOP-16 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | ACTIVE |
| 工艺 | CMOS |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, SHRINK PITCH |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子间距 | 0.6500 mm |
| 端子涂层 | NICKEL PALLADIUM GOLD |
| 端子位置 | DUAL |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | AUTOMOTIVE |
| 系列 | HCT |
| 逻辑IC类型 | MULTIPLEXER |
| 输入数 | 8 |
| 输出数 | 1 |
| 输出极性 | COMPLEMENTARY |
| 传播延迟TPD | 62 ns |

| 74HCT151D,118 | 74HCT151DB,118 | 74HCT151PW,118 | 74HCT151D,653 | 74HC151D,652 | 74HC151DB,112 | 74HC151PW,118 | |
|---|---|---|---|---|---|---|---|
| 描述 | HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 | HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 | HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 | HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 | HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 | HCT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 表面贴装 | Yes | YES | YES | YES | YES | YES | YES |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 系列 | HCT | HCT | HCT | HCT | HC/UH | HC/UH | HC/UH |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| Brand Name | - | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | - | SSOP1 | TSSOP | SOP | SOP | SSOP1 | TSSOP |
| 包装说明 | - | SSOP, SSOP16,.3 | TSSOP, TSSOP16,.25 | SO-16 | SO-16 | SSOP, SSOP16,.3 | TSSOP-16 |
| 针数 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | - | SOT338-1 | SOT403-1 | SOT109-1 | SOT109-1 | SOT338-1 | SOT403-1 |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | compli |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | - | 6.2 mm | 5 mm | - | - | 6.2 mm | 5 mm |
| 负载电容(CL) | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I(ol) | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出次数 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SSOP | TSSOP | SOP | SOP | SSOP | TSSOP |
| 封装等效代码 | - | SSOP16,.3 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | SSOP16,.3 | TSSOP16,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - | - | TAPE AND REEL |
| 峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | - | 5 V | 5 V | 5 V | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | - | 57 ns | 57 ns | 57 ns | 51 ns | 51 ns | 51 ns |
| 传播延迟(tpd) | - | 62 ns | 62 ns | 62 ns | 56 ns | 56 ns | 56 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2 mm | 1.1 mm | - | - | 2 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子节距 | - | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | - | 5.3 mm | 4.4 mm | - | - | 5.3 mm | 4.4 mm |
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