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CBTD3384DB,112: 产品描述CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24; 产品类别逻辑逻辑; 文件大小134KB，共17页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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CBTD3384DB,112概述

CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24

CBT/FST/QS/5C/B系列, 10位驱动, 实输出, PDSO24

CBTD3384DB,112规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SSOP2
包装说明	SSOP, SSOP24,.3
针数	24
制造商包装代码	SOT340-1
Reach Compliance Code	compliant
系列	CBT/FST/QS/5C/B
JESD-30 代码	R-PDSO-G24
JESD-609代码	e4
长度	8.2 mm
逻辑集成电路类型	BUS DRIVER
湿度敏感等级	1
位数	5
功能数量	2
端口数量	2
端子数量	24
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	SSOP
封装等效代码	SSOP24,.3
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	5 V
传播延迟（tpd）	0.25 ns
认证状态	Not Qualified
座面最大高度	2 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	5.3 mm
Base Number Matches	1

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CBTD3384

10-bit level shifting bus switch with 5-bit output enables

Rev. 8 — 12 December 2012

Product data sheet

1. General description

The CBTD3384 provides ten bits of high-speed TTL-compatible bus switching. The low

ON resistance of the switch allows connections to be made with minimal propagation

delay.

The CBTD3384 device is organized as two 5-bit bus switches with two separate output

enable (1OE, 2OE) inputs. When nOE is LOW, the switch is on and port A is connected to

the B port. When nOE is HIGH, each switch is disabled.

The CBTD3384 is characterized for operation from

40 C

to +85

C.

2. Features and benefits



Designed to be used in 5 V to 3.3 V level shifting applications with internal diode



switch connection between two ports

TTL-compatible control input levels

Multiple package options

Latch-up protection exceeds 100 mA per JESD78

ESD protection:



HBM JESD22-A114E exceeds 2000 V



CDM JESD22-C101C exceeds 1000 V

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

CBTD3384D

CBTD3384DB

CBTD3384DK

40 C

to +85

C

40 C

to +85

C

40 C

to +85

C

SO24

SSOP24

Description

plastic shrink small outline package; 24 leads;

body width 5.3 mm

Version

SOT340-1

SOT556-1

SOT355-1

plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

Type number

SSOP24

[1]

plastic shrink small outline package; 24 leads;

body width 3.9 mm; lead pitch 0.635 mm

TSSOP24

plastic thin shrink small outline package; 24 leads;

body width 4.4 mm

CBTD3384PW

40 C

to +85

C

[1]

Also known as QSOP24 package

CBTD3384DB,112相似产品对比

	CBTD3384DB,112	CBTD3384DB,118	CBTD3384PW,112	CBTD3384PW,118	CBTD3384D,112	CBTD3384D,118
描述	CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24	CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24	CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24	CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24	CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24	CBT/FST/QS/5C/B SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
是否Rohs认证	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	SSOP2	SSOP2	TSSOP2	TSSOP2	SOP	SOP
包装说明	SSOP, SSOP24,.3	SSOP, SSOP24,.3	TSSOP, TSSOP24,.25	TSSOP, TSSOP24,.25	SOP, SOP24,.4	SOP, SOP24,.4
针数	24	24	24	24	24	24
制造商包装代码	SOT340-1	SOT340-1	SOT355-1	SOT355-1	SOT137-1	SOT137-1
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
系列	CBT/FST/QS/5C/B	CBT/FST/QS/5C/B	CBT/FST/QS/5C/B	CBT/FST/QS/5C/B	CBT/FST/QS/5C/B	CBT/FST/QS/5C/B
JESD-30 代码	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24
JESD-609代码	e4	e4	e4	e4	e4	e4
长度	8.2 mm	8.2 mm	7.8 mm	7.8 mm	15.4 mm	15.4 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
湿度敏感等级	1	1	1	1	1	1
位数	5	10	5	10	5	10
功能数量	2	1	2	1	2	1
端口数量	2	2	2	2	2	2
端子数量	24	24	24	24	24	24
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SSOP	SSOP	TSSOP	TSSOP	SOP	SOP
封装等效代码	SSOP24,.3	SSOP24,.3	TSSOP24,.25	TSSOP24,.25	SOP24,.4	SOP24,.4
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE
峰值回流温度（摄氏度）	260	260	260	260	260	260
电源	5 V	5 V	5 V	5 V	5 V	5 V
传播延迟（tpd）	0.25 ns	0.25 ns	0.25 ns	0.25 ns	0.25 ns	0.25 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2 mm	2 mm	1.1 mm	1.1 mm	2.65 mm	2.65 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	30
宽度	5.3 mm	5.3 mm	4.4 mm	4.4 mm	7.5 mm	7.5 mm
Base Number Matches	1	1	1	1	1	1

CBTD3384DB,112

CBTD3384DB,112概述

CBTD3384DB,112规格参数

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