AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14
AHCT/VHCT 系列, 双正边沿D触发器, 互补输出, PDSO14
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 |
| 针数 | 14 |
| 制造商包装代码 | SOT762-1 |
| Reach Compliance Code | compli |
| 系列 | AHC/VHC/H/U/V |
| JESD-30 代码 | R-PQCC-N14 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Su | 75000000 Hz |
| 最大I(ol) | 0.008 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC14,.1X.12,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 2/5.5 V |
| Prop。Delay @ Nom-Su | 12 ns |
| 传播延迟(tpd) | 19.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 2.5 mm |
| 最小 fmax | 110 MHz |

| 74AHC74BQ,115 | 74AHCT74D,118 | 74AHCT74PW,112 | 74AHCT74PW,118 | 74AHCT74BQ,115 | 74AHC74PW,112 | |
|---|---|---|---|---|---|---|
| 描述 | AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 | AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 | AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 | AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 | AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 | AHCT/VHCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFN | SOIC | TSSOP | TSSOP | QFN | TSSOP |
| 包装说明 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 | SOP, SOP14,.25 | 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 | TSSOP, TSSOP14,.25 | HVQCCN, LCC14,.1X.12,20 | 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 |
| 制造商包装代码 | SOT762-1 | SOT108-1 | SOT402-1 | SOT402-1 | SOT762-1 | SOT402-1 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| 系列 | AHC/VHC/H/U/V | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT | AHCT/VHCT/VT | AHC |
| JESD-30 代码 | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PQCC-N14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 8.65 mm | 5 mm | 5 mm | 3 mm | 5 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大频率@ Nom-Su | 75000000 Hz | 65000000 Hz | 65000000 Hz | 65000000 Hz | 65000000 Hz | 75000000 Hz |
| 最大I(ol) | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SOP | TSSOP | TSSOP | HVQCCN | TSSOP |
| 封装等效代码 | LCC14,.1X.12,20 | SOP14,.25 | TSSOP14,.25 | TSSOP14,.25 | LCC14,.1X.12,20 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TUBE | TAPE AND REEL | TAPE AND REEL | TUBE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2/5.5 V | 5 V | 5 V | 5 V | 5 V | 2/5.5 V |
| 传播延迟(tpd) | 19.5 ns | 11 ns | 11 ns | 11 ns | 11 ns | 19.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 30 | 30 | 40 | 30 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 2.5 mm | 3.9 mm | 4.4 mm | 4.4 mm | 2.5 mm | 4.4 mm |
| 最小 fmax | 110 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 110 MHz |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved