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74HC238PW,118: 产品描述HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16; 产品类别逻辑逻辑; 文件大小113KB，共18页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HC238PW,118概述

HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16

HC/UH系列, 其他解码器/驱动器, 实输出, PDSO16

74HC238PW,118规格参数

参数名称	属性值
Brand Name	NXP Semiconduc
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP
包装说明	TSSOP, TSSOP16,.25
针数	16
制造商包装代码	SOT403-1
Reach Compliance Code	compli
其他特性	3 ENABLE INPUTS
系列	HC/UH
输入调节	STANDARD
JESD-30 代码	R-PDSO-G16
JESD-609代码	e4
长度	5 mm
负载电容（CL）	50 pF
逻辑集成电路类型	OTHER DECODER/DRIVER
最大I（ol）	0.004 A
湿度敏感等级	1
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP16,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260
电源	2/6 V
Prop。Delay @ Nom-Su	45 ns
传播延迟（tpd）	45 ns
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	4.4 mm
Base Number Matches	1

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74HC238; 74HCT238

3-to-8 line decoder/demultiplexer

Rev. 03 — 16 July 2007

Product data sheet

1. General description

74HC238 and 74HCT238 are high-speed Si-gate CMOS devices and are pin compatible

with Low-Power Schottky TTL (LSTTL).

The 74HC238/74HCT238 decoders accept three binary weighted address inputs (A0, A1,

A2) and when enabled, provide 8 mutually exclusive active HIGH outputs (Y0 to Y7). The

74HC238/74HCT238 features three enable inputs: two active LOW (E1 and E2) and one

active HIGH (E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH.

This multiple enable function allows easy parallel expansion of the “238” to a 1-to-32 (5

lines to 32 lines) decoder with just four “238” ICs and one inverter. The “238” can be used

as an eight output demultiplexer by using one of the active LOW enable inputs as the data

input and the remaining enable inputs as strobes. Unused enable inputs must be

permanently tied to their appropriate active HIGH or LOW state.

The 74HC238/74HCT238 is similar to the 74HC138/74HCT138 but has non-inverting

outputs.

2. Features

Demultiplexing capability

Multiple input enable for easy expansion

Ideal for memory chip select decoding

Active HIGH mutually exclusive outputs

Multiple package options

Complies with JEDEC standard no. 7A

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Speciﬁed from

−40 °C

to +85

°C

and from

−40 °C

to +125

°C

74HC238PW,118相似产品对比

	74HC238PW,118	74HCT238DB,112	74HCT238BQ,115	74HCT238D,653	74HC238PW,112	74HCT238PW,112	74HCT238PW,118
描述	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HCT SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HCT SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HCT SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HCT SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HCT SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HCT SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	TSSOP	SSOP1	QFN	SOP	TSSOP	TSSOP	TSSOP
包装说明	TSSOP, TSSOP16,.25	SSOP, SSOP16,.3	HVQCCN,	SO-16	TSSOP, TSSOP16,.25	TSSOP, TSSOP16,.25	TSSOP,
针数	16	16	16	16	16	16	16
制造商包装代码	SOT403-1	SOT338-1	SOT763-1	SOT109-1	SOT403-1	SOT403-1	SOT403-1
Reach Compliance Code	compli	compli	unknow	compli	compli	compli	unknow
系列	HC/UH	HCT	HCT	HCT	HC/UH	HCT	HCT
输入调节	STANDARD	STANDARD	STANDARD	STANDARD	STANDARD	STANDARD	STANDARD
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PQCC-N16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
长度	5 mm	6.2 mm	3.5 mm	9.9 mm	5 mm	5 mm	5 mm
逻辑集成电路类型	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
湿度敏感等级	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1
端子数量	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	SSOP	HVQCCN	SOP	TSSOP	TSSOP	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260
传播延迟（tpd）	45 ns	53 ns	53 ns	53 ns	45 ns	53 ns	53 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.1 mm	2 mm	1 mm	1.75 mm	1.1 mm	1.1 mm	1.1 mm
最大供电电压 (Vsup)	6 V	5.5 V	5.5 V	5.5 V	6 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	4.5 V	4.5 V	4.5 V	2 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL/PALLADIUM/GOLD (NI/PD/AU)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
端子形式	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.5 mm	1.27 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30
宽度	4.4 mm	5.3 mm	2.5 mm	3.9 mm	4.4 mm	4.4 mm	4.4 mm
Base Number Matches	1	1	1	1	1	1	1
其他特性	3 ENABLE INPUTS	3 ENABLE INPUTS	-	3 ENABLE INPUTS	3 ENABLE INPUTS	3 ENABLE INPUTS	3 ENABLE INPUTS
JESD-609代码	e4	e4	e4	-	e4	e4	e4
负载电容（CL）	50 pF	50 pF	-	50 pF	50 pF	50 pF	50 pF
最大I（ol）	0.004 A	0.004 A	-	0.004 A	0.004 A	0.004 A	-
封装等效代码	TSSOP16,.25	SSOP16,.3	-	SOP16,.25	TSSOP16,.25	TSSOP16,.25	-
电源	2/6 V	5 V	-	5 V	2/6 V	5 V	-
Prop。Delay @ Nom-Su	45 ns	53 ns	-	50 ns	45 ns	53 ns	-

74HC238PW,118

74HC238PW,118概述

74HC238PW,118规格参数

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