3A Avg.
Item
く り 返 し ピ ー ク 逆 電 圧
Repetitive Peak Reverse Voltage
平
均
整
流
電
流
Average Rectified Forward Current
実
効
順
電
流
R.M.S. Forward Current
サ
ー
ジ
順
電
流
Surge Forward Current
動 ½ 接 合 温 度 範 囲
Operating Junction Temperature Range
保
存
温
度
範
囲
Storage Temperature Range
200 Volts
Symbol
V
RRM
I
O
I
F(RMS)
I
FSM
T
jw
T
stg
100
50Hz、正弦半波通電抵抗負荷
50Hz Half Sine Wave Resistive Load
FRED
Conditions
200
Tl＝124℃
Tl＝Lead Temperature
30PRA20
■OUTLINE DRAWING(mm)
Unit
V
3.0
1.6
A
A
A
A
℃
℃
■最大定格 Maximum Ratings
Ta＝34℃
＊
4.71
50Hz正弦半波，１サイクル，非くり返し
50Hz Half Sine Wave,1cycle, Non-repetitive
−40∼＋150
−40∼＋150
■電気的・熱的特性 Electrical/ Thermal Characteristics
Item
ピ
ー
ク
逆
電
Peak Reverse Current
ピ
ー
ク
順
電
Peak Forward Voltage
逆
回
復
時
Reverse Recovery Time
熱
抵
Thermal Resistance
流
圧
間
抗
■APPROX. NET WEIGHT:1.19g
Symbol
I
RM
V
FM
tr r
R
th(j-l)
R
th(j-a)
Conditions
T
j
＝25℃, V
RM
＝V
RRM
T
j
＝25℃, I
FM
＝3A
I
FM
＝3A, −di/dt＝50 A/μs, T
j
＝25℃
接合部½リード間
Junction to Lead
接合部・周囲間
＊
Junction to Ambient
＊
Min.
−
−
−
−
−
Typ.
−
−
−
−
−
Max.
10
1.07
90
8
80
Unit
μA
V
ns
℃/W
℃/W
＊単½フイン無し / Without Fin or P.C. Board
■定格・特性曲線
FIG.1
0°
FIG.2
θ
180°
FIG.3
0°
θ
180°
FORWARD CU RRENT VS. VOLTAGE
50
30PRA20
CONDUCTION ANGLE
AVER AGE FORW ARD POWER DISSIPATION
30PRA20
D.C.
CONDUCTION ANGLE
AVER AGE FORW ARD CURRENT VS. LEAD TEMP ERATURE
30PRA20
5
D.C.
AVERAG E FORWARD POWER DISSIPATION (W)
INSTA NTANEOUS FORWARD CURRENT (A )
4
RECT 180°
20
10
5
4
3
HALF SINE WAVE
RECT 120°
AVERAGE FORWARD CURRENT (A)
RECT 180°
3
HALF SINE WAVE
RECT 120°
RECT 60°
2
1
0.5
2
Tj=25°C
Tj=150°C
2
RECT 60°
1
1
0.2
0
0.4
0.8
1.2
1.6
0
0
1
2
3
4
5
INSTAN TANEOUS FORWARD VOLTAGE (V)
AVERAGE FORWARD CURRE NT (A)
0
0
25
50
75
100
125
150
LEAD TEMPERAT URE (
°C)
FIG.4
0°
FIG.5
SURGE CURRENT RATINGS
f=50Hz,Harf Sine Wave,Non-Repetitive,No Load
30PRA20
120
30PRA20
θ
180°
CONDUCTION ANGLE
AVER AGE FORW ARD CURRENT VS. AMBIENT TEMPERATURE
Without Fin or P.C. Board
2.4
D.C.
RECT 180°
RECT 120°
RECT 60°
HALF SINE WAVE
100
AVERAGE FO RWAR D CURRENT (A)
SURGE FORWARD CURRENT (A)
2.0
80
1.6
60
1.2
40
0.8
0.4
20
0.02s
I FSM
0
0
25
50
75
100
125
150
0
0.02
0.05
0.1
0.2
0.5
1
2
AMBI ENT TEMPE RATURE (
°C)
TIME (s)
42
嵌入式系统
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