HCT SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 14 |
Reach Compliance Code | unknown |
系列 | HCT |
JESD-30 代码 | R-GDFP-F14 |
长度 | 9.21 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | INVERTER |
功能数量 | 6 |
输入次数 | 1 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 48 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 6.29 mm |
SN54HCT14W | SN54HCT14J | SN54HCT14FK | SN74HCT14DBLE | SN74HCT14PW | SN74HCT14PWLE | SN74HCT14QDRQ1 | |
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描述 | HCT SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, FP-14 | HCT SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 | HCT SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, CC-20 | Hex Schmitt-Trigger Inverters 14-SSOP -40 to 85 | HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, TSSOP-14 | Hex Schmitt-Trigger Inverters 14-TSSOP -40 to 85 | HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, PLASTIC, SOIC-14 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | DFP | DIP | QFN | SSOP | TSSOP | TSSOP | SOIC |
包装说明 | DFP, | DIP, | QCCN, | PLASTIC, MO-150, SSOP-14 | TSSOP-14 | TSSOP, TSSOP14,.25 | SOP, SOP14,.25 |
针数 | 14 | 14 | 20 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | not_compliant | compliant | not_compliant | unknown |
系列 | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
JESD-30 代码 | R-GDFP-F14 | R-GDIP-T14 | S-CQCC-N20 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
长度 | 9.21 mm | 19.56 mm | 8.89 mm | 6.2 mm | 5 mm | 5 mm | 8.65 mm |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
功能数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 20 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DFP | DIP | QCCN | SSOP | TSSOP | TSSOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
传播延迟(tpd) | 48 ns | 48 ns | 48 ns | 40 ns | 40 ns | 40 ns | 48 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 2 mm | 1.2 mm | 1.2 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
端子形式 | FLAT | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
宽度 | 6.29 mm | 7.62 mm | 8.89 mm | 5.3 mm | 4.4 mm | 4.4 mm | 3.9 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
封装等效代码 | - | - | - | SSOP14,.3 | TSSOP14,.25 | TSSOP14,.25 | SOP14,.25 |
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