HS18380-HS183100
G
J
B
Std. Polarity
Base is cathode
Rev. Polarity
Base is anode
F
C
D
Dim. Inches
Millimeter
Minimum Maximum Minimum Maximum Notes
A
B
C
D
E
F
G
H
J
K
L
1.52
.725
.605
1.182
.745
.152
.525
.156
.495
.120
38.61
1.56
18.42
.775
15.37
.625
30.02
1.192
18.92
.755
3.86
.160
1/4-20 UNC-2B
13.34
.580
3.96
.160
12.57
.505
3.05
.130
39.62
19.69
15.88
30.28
19.18
4.06
14.73
4.06
12.83
3.30
180 Amp Schottky Rectifier
K
H
E
Sq.
Dia.
Dia.
A
L
Microsemi
Catalog Number
HS18380*
HS18390*
HS183100*
Idustry
Part Number
183NQ080
MBR20080
183NQ100
MBR200100
Working Peak
Repetitive Peak
Reverse Voltage Reverse Voltage
80V
90V
100V
80V
90V
100V
Schottky Barrier Rectifier
Guard Ring Protection
180 Amperes/80 to 100 Volts
175°C Junction Temperature
Reverse Energy Tested
ROHS Compliant
*Add suffix R for Reverse Polarity
Electrical Characteristics
Average forward current
Maximum surge current
Maximum repetitive reverse current
Max peak forward voltage
Max peak reverse current
Max peak reverse current
Typical junction capacitance
I F(AV)
I FSM
I R(OV)
VFM
I RM
I RM
CJ
180 Amps
2500 Amps
2 Amps
0.91 Volts
100mA
5mA
4800pF
TC = 116°C, Square wave, R0JC = 0.32°C/W
8.3ms, half sine, T J = 175°C
f = 1 KHZ, 1µs square wave, TJ = 25°C
I FM = 180A: T J = 25°C*
VRRM, T J = 125°C*
VRRM, T J = 25°C
VR = 5.0V, T J = 25°C, f = 1MHz
*Pulse test: Pulse width 300µsec, Duty cycle 2%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Max thermal resistance
Typical thermal resistance (greased)
Terminal Torque
Mounting Base Torque
Weight
T STG
TJ
R OJC
R OCS
-55°C to 175°C
-55°C to 175°C
0.32°C/W junction to case
0.12°C/W case to sink
35-40 inch pounds
20-25 inch pounds
1.1 ounces (32 grams) typical
www.microsemi.com
October, 2012 - Rev. 6
HS18380-HS183100
Figure 1
Typical Forward Characteristics
10000
8000
6000
Junction Capacitance - pF
4000
Figure 3
Typical Junction Capacitance
100,000
60,000
40,000
20,000
10,000
6000
4000
2000
1000
0.1
2000
1000
800
600
400
0.5
1.0
5.0
10
50
100
Reverse Voltage - Volts
Figure 4
200
Maximum Allowable Case Temperature - C
Forward Current Derating
175
165
155
145
135
125
115
105
60
90 120 180
DC
300
240
60
120
180
0
Average Forward Current - Amperes
Instantaneous Forward Current - Amperes
100
80
60
40
175 C
25 C
20
10
0
.6
.2
.4
.8
1.0
1.2
Instantaneous Forward Voltage - Volts
1.4
Figure 5
Maximum Forward Power Dissipation
Maximum Power Dissipation - Watts
280
240
200
160
120
80
40
0
0
60
120
180
240
300
Average Forward Current - Amperes
60
120
90
180
DC
Figure 2
Typical Reverse Characteristics
1000
Typical Reverse Current - mA
100
10
125 C
1.0
0.1
.01
175 C
75 C
25 C
0
20
40
60
80
100
Reverse Voltage - Volts
www.microsemi.com
October, 2012 - Rev. 6
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
www.microsemi.com
October, 2012
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
