EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 包装说明 | TSSOP, TSSOP28,.53,22 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 250 ns |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 页面大小 | 64 words |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0002 A |
| 最大压摆率 | 0.05 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.55 mm |
| 端子位置 | DUAL |
| 切换位 | YES |
| 最长写入周期时间 (tWC) | 10 ms |
| AT28C256E-25TC | AT28C256F-25SC | AT28C256F-25SI | AT28C256F-25TC | AT28C256F-25TI | AT28C256E-25SC | AT28C256E-25SI | AT28C256E-25TI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | TSSOP, TSSOP28,.53,22 | SOP, SOP28,.4 | SOP, SOP28,.4 | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP28,.53,22 | SOP, SOP28,.4 | SOP, SOP28,.4 | TSSOP, TSSOP28,.53,22 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns | 250 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES |
| 耐久性 | 100000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 湿度敏感等级 | 3 | 2 | 2 | 3 | 3 | 2 | 2 | 3 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | SOP | TSSOP | TSSOP | SOP | SOP | TSSOP |
| 封装等效代码 | TSSOP28,.53,22 | SOP28,.4 | SOP28,.4 | TSSOP28,.53,22 | TSSOP28,.53,22 | SOP28,.4 | SOP28,.4 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 页面大小 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.55 mm | 1.27 mm | 1.27 mm | 0.55 mm | 0.55 mm | 1.27 mm | 1.27 mm | 0.55 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最长写入周期时间 (tWC) | 10 ms | 3 ms | 3 ms | 3 ms | 3 ms | 10 ms | 10 ms | 10 ms |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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