LINE DRIVER, CDIP16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | TTL COMPATIBLE INPUTS |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | EIA-422 |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 7.62 mm |
| HS1-26CT31RH/PROTO | HS9-26CT31RH-Q | HS9-26CT31RH-8 | HS1-26CT31RH-T | HS9-26CT31RH/PROTO | HS1-26CT31RH-8 | HS9-26CT31RH-T | |
|---|---|---|---|---|---|---|---|
| 描述 | LINE DRIVER, CDIP16 | QUAD LINE DRIVER, CDFP16, CERAMIC, FP-16 | QUAD LINE DRIVER, CDFP16, CERAMIC, FP-16 | QUAD LINE DRIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | QUAD LINE DRIVER, CDFP16, CERAMIC, FP-16 | QUAD LINE DRIVER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16 |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | DIP | DFP | DFP | DIP | DFP | DIP | DFP |
| 包装说明 | DIP, | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, | DIP, DIP16,.3 | DFP, FL16,.3 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | USML XV(E) | USML XV(E) | EAR99 | USML XV(E) | EAR99 | USML XV(E) |
| 差分输出 | YES | YES | YES | YES | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 | 4 | 4 | 4 | 1 |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | EIA-422 | EIA-422 | EIA-422 | EIA-422 | EIA-422 | EIA-422 | EIA-422 |
| JESD-30 代码 | R-CDIP-T16 | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | DFP | DIP | DFP | DIP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.92 mm | 2.92 mm | 5.08 mm | 2.92 mm | 5.08 mm | 2.92 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE |
| 宽度 | 7.62 mm | 6.73 mm | 6.73 mm | 7.62 mm | 6.73 mm | 7.62 mm | 6.73 mm |
| 其他特性 | TTL COMPATIBLE INPUTS | TTL COMPATIBLE INPUTS | TTL COMPATIBLE INPUTS | - | TTL COMPATIBLE INPUTS | TTL COMPATIBLE INPUTS | - |
| JESD-609代码 | e0 | e4 | e4 | - | e4 | e4 | e3 |
| 端子面层 | TIN LEAD | Gold (Au) | Gold (Au) | - | Gold (Au) | Gold (Au) | MATTE TIN |
| 总剂量 | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | 100k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | - |
| 高电平输入电流最大值 | - | 0.000001 A | 0.000001 A | 0.000001 A | - | 0.000001 A | 0.000001 A |
| 最小输出摆幅 | - | 2 V | 2 V | 2 V | - | 2 V | 2 V |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 封装等效代码 | - | FL16,.3 | FL16,.3 | DIP16,.3 | - | DIP16,.3 | FL16,.3 |
| 电源 | - | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 筛选级别 | - | MIL-PRF-38535 Class V | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class T | - | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class T |
| 最大传输延迟 | - | 22 ns | 22 ns | 28 ns | - | 22 ns | 28 ns |
嵌入式系统
微控制器 MCU
51单片机
FPGA/CPLD
电源技术
单片机
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
