F-213
QTS–025–01–L–D–A
®
QTS–050–01–F–D–A
QTS–075–01–F–D–A
(0,635 mm) .025"
QTS SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTS
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact: 1.1A per contact
@ 30°C Temperature Rise
Ground Plane: 7.8A per ground
plane @ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSS
Cable Mates:
SQCD
Integral metal plane
for power or ground
TM
Alignment
Pin
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSS
Processing:
QTS/QSS
Type
Rated @ 3dB Insertion Loss*
5 mm Stack Height
Single-Ended Signaling
–D
9 GHz / 18 Gbps
Differential Pair Signaling
–D
8.5 GHz / 17 Gbps
Differential Pair Signaling –DP
8.5 GHz / 17 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?QTS or contact
sig@samtec.com
(0,635 mm)
.025"
pitch
Polarized
ALSO AVAILABLE
• Board spacing
standoffs
(See SO Series)
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (025-075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
QTS
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart.
PLATING
OPTION
D
A
OTHER
OPTION
APPLICATION
SPECIFIC OPTION
• 11 mm & 16 mm stack
height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
Call Samtec.
–025, –050, –075
(50 total positions per bank)
–F
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–K
= (7,00 mm)
.275" DIA
Polyimide film
Pick &
Place Pad
–L
= 10µ" (0,25 µm) Gold on Signal
Pins and Ground Plane,
Matte Tin on tails
–TR
= Tape & Reel
–C*
(No. of Positions per Row/25) x (20,00) .7875
(20,00) .7875
(7,11)
.280
02
01
(5,97)
.235
(0,635) .025
(0,20) .008
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au over
50µ" (1,27 µm) Ni on Ground
Plane in contact area,
Matte Tin over 50µ" (1,27 µm)
min Ni on all solder tails
A
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(0,76)
.030
(0,89)
.035
DIA
STACK HEIGHTS
LEAD
MATED
A
STYLE
HEIGHT
–01
–02
(4,27) .168 (5,00) .197
(7,26) .286 (8,00) .315
Processing conditions will
affect mated height.
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