REVISION M
DO NOT
SCALE FROM
THIS PRINT
* = SEE NOTE 11
((NO OF POS / 25) x .7875 [20.003]) + .390 [9.91] REF
C5
QTS-XXX-01-XXX-D-EMX-XX
No OF POSITIONS
-025, -050, -075,
**-100, **-125
(PER ROW)
**SEE NOTE 12
LEAD STYLE
-01: .1680[4.267]
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD WITH MATTE TIN TAILS
(USE T-1S42-XX-F & T-1G1-01-F)
[SEE NOTE 7]
-L: LIGHT SELECTIVE GOLD WITH MATTE TIN TAILS
(USE T-1S42-XX-L & T-1G1-01-L)
-H: HEAVY GOLD
(USE T-1S42-XX-H & T-1G1-01-G)
OPTION
-TY: TRAY PACKAGING
EDGE MOUNT THICKNESS
-EM2:
.064[1.63] +/-.004 PCB
(USE QTS-25-01-D-EM2-XX &
T-1S42-01-XXX)
-EM3:
(USE QTS-25-01-D-EM3-XX &
T-1S42-02-XXX)
SEE NOTE 11
(No OF POSITIONS / 25) x .7875[20.003] REF
01
.7875 20.003 REF
.1550 3.94 REF
-FTL: FLASH SELECTIVE GOLD,
TIN/LEAD TAIL
(USE T-1S42-XX-FTL & T-1G1-01-FTL)
-STL: SELECTIVE GOLD,
TIN/LEAD TAIL
(USE T-1S42-XX-STL & T-1G1-01-STL)
.2350 5.969
REF
QTS-25-01-D-EMX-XX
ROW SPECIFICATION
-D: DOUBLE
(USE QTS-25-XX-D-EMX-XX)
No OF BANKS
02
.0325 0.826 REF
24 EQ SPACES
@ .0250 [.635]
.6440 16.36 REF
C3
"A"
.1600 4.06 REF
.1750 4.45
REF
.1290 3.277
.1400 3.56 REF
"C" REF
T-1G1-01-XXX
.7450 18.92 REF
.1680 4.267
C2
(SEE NOTE 5)
SEE TABLE 2
T-1S42-XX-XXX
"A"
.1288 3.270
.0400 1.02 REF
.152 3.86 REF
C4
.118 3.00
.2782 7.07
REF
"A" REF
.0080 0.203
REF
2 MAX SWAY
(TYP)
C1
"B"±.0030 1.626±0.076
(INSIDE TO INSIDE OF PIN)
.015 0.38 REF
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. BURR ALLOWANCE: .0015 [.038]MAX.
3. MINIMUM PUSHOUT FORCE: 6 OZ.
4. MINIMUM GROUND PLANE RETENTION: 1 LB.
5. MAXIMUM VARIANCE: .002 [.05].
6. PARTS TO BE MOLDED TO POSITION.
7. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING (TERMINAL).
8. NOTE DELETED.
9. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
10. SEE www.samtec.com/processing/edgemt_tectalk/index.htm FOR
PROCESSING EDGE MOUNT PARTS TO BOARD.
11. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
12. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP.
P
13. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
SECTION "A"-"A"
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
.XX: .01[.3]
2
.XXX: .005[.13]
.XXXX: .0020[.051]
MATERIAL:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DO NOT SCALE DRAWING
SHEET SCALE: 1.5:1
INSULATOR: LCP, COLOR: BLACK
TERMINAL: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
F:\DWG\MISC\MKTG\QTS-XXX-01-XXX-D-EMX-XX-MKT.SLDDRW
.635mm EDGE MOUNT HS TERMINAL ASSEMBLY
DWG. NO.
QTS-XXX-01-XXX-D-EMX-XX
4/24/2000
SHEET
1
OF
1
BY:
DEAN P
微控制器 MCU
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