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PTFA081501E

产品描述Thermally-Enhanced High Power RF LDMOS FETs 150 W, 864-900 MHz
产品类别分立半导体    晶体管   
文件大小255KB,共11页
制造商Infineon(英飞凌)
官网地址http://www.infineon.com/
标准
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PTFA081501E概述

Thermally-Enhanced High Power RF LDMOS FETs 150 W, 864-900 MHz

PTFA081501E规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Infineon(英飞凌)
包装说明GREEN, H-30248-2
针数2
Reach Compliance Codecompli
ECCN代码EAR99
外壳连接SOURCE
配置SINGLE
最小漏源击穿电压65 V
FET 技术METAL-OXIDE SEMICONDUCTOR
最高频带ULTRA HIGH FREQUENCY BAND
JESD-30 代码R-CDFM-F2
JESD-609代码e3
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度200 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式FLANGE MOUNT
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)449 W
认证状态Not Qualified
表面贴装YES
端子面层MATTE TIN
端子形式FLAT
端子位置DUAL
晶体管应用AMPLIFIER
晶体管元件材料SILICON

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PTFA081501E
PTFA081501F
Thermally-Enhanced High Power RF LDMOS FETs
150 W, 864 – 900 MHz
Description
The PTFA081501E and PTFA081501F are thermally-enhanced,
150-watt, internally matched
GOLDMOS
®
FETs intended for ultra-
linear applications. They are characaterized for CDMA and
CDMA2000 operation from 864 to 900 MHz. Thermally-enhanced
packages provide the coolest operation available. Full gold
metallization ensures excellent device lifetime and reliability.
PTFA081501E
Package H-30248-2
PTFA081501F
Package H-31248-2
IS-95 CDMA Performance
V
DD
= 28 V, I
DQ
= 950 mA, ƒ = 900 MHz
T
CASE
= 25°C
T
CASE
= 90°C
Features
Adjacent Channel Power
Ratio (dBc)
Thermally-enhanced packages, Pb-free and
RoHS-compliant
Broadband internal matching
Typical CDMA2000 performance at 900 MHz, 28 V
- Average output power = 35 W
- Linear Gain = 18 dB
- Efficiency = 34%
- Adjacent channel power = –50 dBc
Typical CW performance, 900 MHz, 28 V
- Output power at P–1dB = 165 W
- Efficiency = 62%
Integrated ESD protection: Human Body Model,
Class 2 (minimum)
Excellent thermal stability, low HCI drift
Capable of handling 10:1 VSWR @ 28 V,
170 W (CW) output power
50
40
-30
-40
Drain Efficiency (%)
Adj 750 kHz
30
20
-50
-60
Efficiency
10
0
32
34
36
38
40
42
44
46
48
Alt1 1.98 MHz
-70
-80
Output Power (dBm), Avg.
RF Characteristics
CDMA2000 3-Carrier Measurements
(not subject to production test—verified by design/characterization in Infineon test
fixture)
V
DD
= 28 V, I
DQ
= 950 mA, P
OUT
= 35 W average, ƒ = 900 MHz
Characteristic
Gain
Drain Efficiency
Adjacent Channel Power Ratio
All published data at T
CASE
= 25°C unless otherwise indicated
Symbol
G
ps
Min
Typ
18
34
–50
Max
Unit
dB
%
dBc
η
D
ACPR
*See Infineon distributor for future availability.
ESD:
Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet
1 of 10
Rev. 03, 2007-03-09

PTFA081501E相似产品对比

PTFA081501E PTFA081501F
描述 Thermally-Enhanced High Power RF LDMOS FETs 150 W, 864-900 MHz Thermally-Enhanced High Power RF LDMOS FETs 150 W, 864-900 MHz
是否Rohs认证 符合 符合
厂商名称 Infineon(英飞凌) Infineon(英飞凌)
包装说明 GREEN, H-30248-2 GREEN, H-31248-2
针数 2 2
Reach Compliance Code compli compli
ECCN代码 EAR99 EAR99
外壳连接 SOURCE SOURCE
配置 SINGLE SINGLE
最小漏源击穿电压 65 V 65 V
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
最高频带 ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 代码 R-CDFM-F2 R-CDFM-F2
元件数量 1 1
端子数量 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 200 °C 200 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT FLANGE MOUNT
极性/信道类型 N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 449 W 449 W
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
端子形式 FLAT FLAT
端子位置 DUAL DUAL
晶体管应用 AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON

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