MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
WDFN8 3.3x3.3, 0.65P
CASE 511AB−01
ISSUE B
2X
SCALE 2:1
0.20 C
D
D1
8 7 6 5
DATE 20 JAN 2009
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH
PROTRUSIONS OR GATE BURRS.
A
B
2X
0.20 C
E1 E
4X
q
1 2 3 4
TOP VIEW
0.10 C
A
0.10 C
SIDE VIEW
8X
c
A1
6X
C
SEATING
PLANE
e
DETAIL A
DETAIL A
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
MILLIMETERS
MIN
NOM
MAX
0.70
0.75
0.80
0.00
−−−
0.05
0.23
0.30
0.40
0.15
0.20
0.25
3.30 BSC
2.95
3.05
3.15
1.98
2.11
2.24
3.30 BSC
2.95
3.05
3.15
1.47
1.60
1.73
0.65 BSC
0.30
0.41
0.51
0.64
−−−
−−−
0.30
0.43
0.56
0.06
0.13
0.20
1.40
1.50
1.60
0
_
−−−
12
_
INCHES
NOM
MAX
0.030
0.031
−−−
0.002
0.012
0.016
0.008
0.010
0.130 BSC
0.116
0.120
0.124
0.078
0.083
0.088
0.130 BSC
0.116
0.120
0.124
0.058
0.063
0.068
0.026 BSC
0.012
0.016
0.020
0.025
−−−
−−−
0.012
0.017
0.022
0.002
0.005
0.008
0.055
0.059
0.063
0
_
−−−
12
_
MIN
0.028
0.000
0.009
0.006
b
L
e/2
1
4
SOLDERING FOOTPRINT*
0.42
K
PACKAGE
OUTLINE
8X
0.10
0.05
C A B
c
0.65
PITCH
0.66
4X
E2
8
5
M
D2
BOTTOM VIEW
L1
0.75
0.57
2.30
3.60
G
GENERIC
MARKING DIAGRAM*
1
XXXXX
AYWWG
G
0.47
2.37
3.46
DIMENSION: MILLIMETERS
XXXXX
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “
G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD: REF TO JEDEC MO−240
©
Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DESCRIPTION: WDFN8 3.3X3.3, 0.65P
October, 2002
−
Rev. 0
PAGE 1 OF
XXX
2
1
DOCUMENT NUMBER:
98AON30561E
DOCUMENT NUMBER:
98AON30561E
PAGE 2 OF 2
ISSUE
O
A
B
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. MOSHER.
ADDED GENERIC MARKING INFORMATION. REQ. BY B. MOSHER.
CHANGED MAX DIMENSION “B” FROM 0.41MM TO 0.40MM. REQ. BY NK THEN.
DATE
30 MAY 2008
07 AUG 2008
20 JAN 2009
ON Semiconductor
and
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©
Semiconductor Components Industries, LLC, 2009
January, 2009
−
Rev. 01B
Case Outline Number:
511AB
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