SKAI 90 A2 GD06-W24DI
Characteristics
Symbol
V
isol
V
CC
Conditions
DC, t = 1 s
DC supply voltage
rms @ rated conditions: dV/dt = 10l/
min, 50% Glykol/ 50% H
2
0, f
sw
= 4kHz,
V
CC
= 350V, V
out
= 200V, f
out
= 50 Hz,
cos(phi) = 0.85, M = 0.93,
T
coolant
= 65 °C, T
air
= 65 °C
Switching frequency
DC Bus Capacitance
EMI Capacitor; DC to enclosure
DC+ to enclosure, DC- to enclosure
DC+ to DC-
min.
typ.
3000
350
max.
Unit
V
Electrical Data
450
V
I
nom
300
A
HV SKAI 2
Three-phase IGBT inverter
SKAI 90 A2 GD06-W24DI
Target Data
Features
•
•
•
•
Optimized for HEV and EV
high power density
high overload capability
Compact integration in IP67 Enclosure:
V, I, T sensors
Gate driver with protection features
EMI filters
Liquid cooling
DC link capacitor
f
sw
C
DC
C
y
R
F
R
BL
Weight
Height
Width
Length
M
t
M
c
M
cg
M
e
M
gnd
1
0.9
0.66
7.5
1
15
109
244
475
15
1.25
kHz
mF
µF
M
M
kg
mm
mm
mm
Mechanical Data
AC / DC terminals (M8 screw)
Cover of terminal box (M5x16
flat-head-screw)
AC / DC cable glands (recommended)
Assembly of
M8 screw
enclosure;
thread (l): > 15mm M6 screw
Ground connection
13
3.5
14
4
10
15
4.5
20
14
Nm
Nm
Nm
Nm
Nm
Nm
mbar
Typical Applications*
• commercial application vehicle
• hybrid vehicle
• battery driven vehicle
13
14
100
15
No. 14282009
Hydraulical Data
Pressure drop@ 10l/min,
dp
T
coolant
= 25°C
p
Operating pressure
P
T
stg
T
no
T
air
T
coolant
IP
Altitude
Power dissipation to coolant; rated
conditions
storage temperature
Non operating temperature range
Operating range, derating for
T
air
> 85°C
Operating range, derating for
T
coolant
> 65°C
Enclosure protection level
With external connector protection
V
CC
=450 V
-40
-40
-40
-40
2
1.9
85
105
105
75
IP67
IP6K9K
5000
bar
kW
°C
°C
°C
°C
Environmental Data
m
HV SKAI 2
© by SEMIKRON
Rev. 7 – 20.04.2011
1
SKAI 90 A2 GD06-W24DI
Characteristics
Symbol
V
s
I
SO
I
S
V
iH
V
iL
t
POR
t
pRESET
Conditions
Auxiliary supply voltage primary side
Auxiliary supply current primary side
without driving a gate (V
s
= 24 V)
Auxiliary supply current primary side,
driving the gates (V
s
= 24 V)
Input signal voltage (HIGH)
Input signal voltage (LOW)
Power-on reset completed
Error reset time
Input-output turn-on propagation time
Input-output turn-off propagation time
Signal transfer prim - sec (total jitter)
Short pulse suppression time
Input impulse extension time
Error input-output propagation time for
DSCP error
Error input-output propagation time for
OCP error
Error input-output propagation time for
temperature error
Top-Bot interlock dead time
VCE monitoring blanking time
Over temperature protection trip level
(PCB)
Over temperature protection trip level
on ceramic-substrate
Release temperature for PCB
overtemperature trip level
Release temperature for ceramic
substrate overtemperature trip level
Trip level of DC-link voltage monitoring
Under voltage protection trip level of
board primary side
Threshold voltage level for driver reset
after failure event
Overcurrent trip level
AC sensing range
Gradient of output current sensing
Bandwidth (3 dB) of AC current sensing
Measurable DC-link-voltage
Gradient of DC-link voltage sensing
Bandwidth (3 dB) of DC-link voltage
sensing
Temperature sensing range on ceramic
substrate
Gradient of temperature sensing on
ceramic-substrate
Bandwidth of temperature sensing on
ceramic-substrate
min.
16
typ.
24
max.
32
450
1500
Unit
V
mA
mA
V
V
s
s
µs
µs
ns
µs
µs
µs
µs
ms
µs
µs
°C
°C
°C
°C
V
Interface parameters
0.7 * Vs
GND - 0.3
0.1
Vs + 0.3
0.3 * Vs
0.9
3
0.5
0.5
0.6
0.6
50
0.3
1.1
1
4
10
50
4
5
4.1
5.1
HV SKAI 2
Three-phase IGBT inverter
SKAI 90 A2 GD06-W24DI
Target Data
Features
•
•
•
•
Optimized for HEV and EV
high power density
high overload capability
Compact integration in IP67 Enclosure:
V, I, T sensors
Gate driver with protection features
EMI filters
Liquid cooling
DC link capacitor
Controller switching parameters
t
d(on)IO
t
d(off)IO
t
jitter
t
SIS
t
et
t
d(err)DSCP
t
d(err)OCP
t
d(err)TMP
t
TD
t
bl
T
PCBtrip
T
CStrip
T
RelPCBtrip
T
RelCStrip
V
DCtrip
V
VStrip
V
VSrst
I
TRIPSC
I
outsens
m
Ioutsens
BW
Ioutsens
V
DCsens
m
VDCsens
BW
VDCsens
T
CSsens
m
TCSsens
BW
TCSsens
0.2
0.9
0.2
0.25
1
Protection functions
100
120
90
85
450
14
16
850
-924
10.8
0
19.669
20.067
0.25
30
83.3
100
150
11.13
17
600
20.472
924
11.47
Typical Applications*
• commercial application vehicle
• hybrid vehicle
• battery driven vehicle
No. 14282009
V
V
A
PEAK
A
mV/A
kHz
V
mV/V
kHz
°C
mV/°C
Hz
HV SKAI 2
2
Rev. 7 – 20.04.2011
© by SEMIKRON
SKAI 90 A2 GD06-W24DI
Signal Connector
PIN
X1:01
X1:02
X1:03
Signal
PWR_VP
PWR_GND
Function
INPUT
Auxiliary power supply / battery “+”
Auxiliary power supply ground
Specifications
Supply voltage V
s
Ground of auxiliary power supply
HIGH, NOT CONNECTED (n.c.) or module
not supplied with Auxiliary power = DC Link
discharge active
LOW = DC Link discharge disabled
(internal pull-up resistor, external pull-up
resistor required as well)
X1:04
CMN_HALT
INPUT/OUTPUT
All connected units have to change the signal
mode to „dominant“ if following happens:
The unit is not ready to operate
Error happened
All connected units must be able to process
(read) the signal. In case of recognised
dominant signal, following steps need to be
performed:
The unit must be switched to a defined safe
operation mode
The unit must interrupt the main process unitl
a recessive signal has been recognised
LOW (dominant) = not ready to operate
HIGH (recessive) = ready to operate
X1:05
X1:06
CMN_TEMP_GND
HB1_TOP
Ground for temperature sensor signal
CMN_TEMP
INPUT
Switching PWM signal [push/pull]
INPUT
Switching PWM signal [push/pull]
INPUT
Switching PWM signal [push/pull]
INPUT
Switching PWM signal [push/pull]
INPUT
Switching PWM signal [push/pull]
INPUT
Switching PWM signal [push/pull]
GND
Internally connected to PWR_GND
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:07
HB1_BOT
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:08
HB2_TOP
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:09
HB2_BOT
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:10
HB3_TOP
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:11
HB3_BOT
Digital PWR_VP logic
LOW = IGBT off
HIGH = IGBT on
X1:12
CAN_GND
Ground of CAN bus
DC_LINK_DISCHAR INPUT
GE
© by SEMIKRON
Rev. 7 – 20.04.2011
3
SKAI 90 A2 GD06-W24DI
PIN
X1:13
X1:14
X1:15
X1:16
Signal
PWR_VP
PWR_GND
CMN_GND
CMN_TEMP
Function
INPUT
Auxiliary power supply / battery “+”
Auxiliary power supply ground
Ground for CMN_DIAG, CMN_HALT,
CMN_GPIO
OUTPUT
Temperature sensor signal CMN_TEMP
Specifications
Supply voltage V
s
Ground of auxiliary power supply
Internally connected to PWR_GND
This pin is used to transmit the temperature
sensor analog signal.
Max. output current: 5 mA
Nominal voltage range: 0…10 V
X1:17
X1:18
X1.19
X1:20
X1:21
X1:22
X1:23
Reserved
HB1_GND
Reserved
HB2_GND
Reserved
HB3_GND
CAN_L
Ground for HB3_TOP, HB3_BOT
INPUT/OUTPUT
CAN interface LOW line
Internally connected to PWR_GND
Input impedance = 121
Specification:
ISO 11783 (2.5V, 250 kbit/sec minimum,
quad twisted cable) or J1939/11 (250 kbit/sec
minimum, twisted shielded pair).
X1:24
X1:25
X1:26
PWR_VP
PWR_GND
CMN_DIAG
INPUT
Auxiliary power supply / battery “+”
Auxiliary power supply ground
INPUT/OUTPUT
Single line CAN communication
[dominant/recessive]
Supply voltage V
s
Ground of auxiliary power supply
Dominant/Recessive diagnose input/output
signal. All connected units can communicate
using this serial signal for setting/getting
parameters of the unit and reading error
information from unit registers.
This pin is used to transmit the DC-Link
voltage level.
Max. output current: 5 mA
Nominal voltage range: 0….+10 V
X1:28
X1:29
CMN_DCL_GND
HB1_I
Ground for DC-Link voltage signal CMN_DCL Internally connected to PWR_GND
OUTPUT
Current sensor out for HB1
[analog]
Ground for HB1_I
OUTPUT
Current sensor out for HB2
[analog]
Ground for HB2_I
OUTPUT
Current sensor out for HB3
[analog]
Ground for HB3_I
INPUT/OUTPUT
CAN interface HIGH line
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
Internally connected to PWR_GND
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
Internally connected to PWR_GND
Max. output current: 5 mA
Nominal voltage range: -10 … +10 V
Internally connected to PWR_GND
Input impedance = 121
Specification:
ISO 11783 (2.5V, 250 kbit/sec minimum,
quad twisted cable) or J1939/11 (250 kbit/sec
minimum, twisted shielded pair).
Ground for HB2_TOP, HB2_BOT
Internally connected to PWR_GND
Ground for HB1_TOP, HB1_BOT
Internally connected to PWR_GND
X1:27
CMN_DCL
OUTPUT
DC-Link voltage signal
[analog]
X1:30
X1:31
HB1_I_GND
HB2_I
X1:32
X1:33
HB2_I_GND
HB3_I
X1:34
X1:35
HB3_I_GND
CAN_H
4
Rev. 7 – 20.04.2011
© by SEMIKRON
SKAI 90 A2 GD06-W24DI
Power Connectors
Terminal
DC+
DC-
Function
HVDC Bus "+"
HVDC Bus "-"
cable harness cross section Cu / mm²
≤
70
≤
70
L1
L2
L3
Coolant fittings
Terminal
IN
OUT
Phase L1
Phase L2
Phase L3
≤
70
≤
70
≤
70
Function
Coolant Inlet
Coolant Outlet
© by SEMIKRON
Rev. 7 – 20.04.2011
5
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