3M
™
HDC Header
.100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit
HDC Series
• High density, up to 240 contacts single bay and 366
contacts dual bay
• Early Mate Late Break (EMLB) grounding contacts
for hot swapping
• Mates with three-row and four-row sockets
• See Regulatory Information Appendix (RIA) for
chemical compliance information
Date Modified: March 25, 2008
TS-1136-C
Sheet 1 of 7
Physical
Insulation:
Material: Glass Filled Thermoplastic (LCP)
Flammability: UL 94V-0
Color: Black
Contact:
Material: Copper Alloy
Plating:
Underplating: 50 μ” [ 1.27 μm ] min. Nickel
Wiping Area: See Ordering Information
Termination Area: See Ordering Information
Marking:
Part Number and Date Code
Electrical
Current Rating:
3.0 A
Insulation Resistance:
1 x 10
3
M
Ω
min. at 500 V
DC
Withstanding Voltage:
900 V
AC
for 1 minute
Environmental
Temperature Rating:
-55°C to +105°C
Process Rating:
Maximum 260°C (per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
UL File No.: E68080
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
HDC Header
.100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit
3-Row Single Bay
A
B
.100
2.54
2
3
4
5 6
HDC Series
Z
8
7
Z
C
D
.100
2.54
PIN #1
SOLDER TAIL
PRESS-FIT TAIL
2X .275
ROW C
ROW B
ROW A
O
.037 - .043 PLATED-THRU HOLE, PRESS-FIT
O
.041-.049 PLATED-THRU HOLE, SOLDER TAIL
l O
.004 A B
Body footprint
-B-
.100 TYP.
C
B
A
PIN #1
RECOMMENDED P.C.B. HOLE PATTERN
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
1
ROW C
ROW B
ROW A
B A H
G
C
F
E
.480
12.19
.100
2.54
.375
9.52
.025
0.64
.210
5.33
.275
6.98
q
.462
11.73
F
.030
0.76
SECTION Z-Z
In c h
[m m ]
T o le ra n c e U n le s s N o te d
.0
in c h
± .1
.0 0
.0 0 0
± .0 1 ± .0 0 5
[ ] D im e n s io n s fo r R e fe re n c e
O n ly
O
.120 2 Plcs.
.100 TYP.
-A-
.485
TS-1136-C
Sheet 2 of 7
3M
™
HDC Header
.100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit
Product Table/Dimensions for 3 Row, Single Bay
Description
HDC-H045-31XX-XXXX
HDC-H072-31XX-XXXX
HDC-H075-31XX-XXXX
HDC-H090-31XX-XXXX
HDC-H096-31XX-XXXX
HDC-H102-31XX-XXXX
HDC-H120-31XX-XXXX
HDC-H135-31XX-XXXX
Pin
Quantity
45
72
75
90
96
102
120
135
A
2.250
[57.15]
3.150
[80.01]
3.250
[82.55]
3.750
[95.25]
3.950
[100.33]
4.150
[105.41]
4.750
[120.65]
5.250
[133.35]
B
1.950
[49.53]
2.850
[72.39]
2.950
[74.93]
3.450
[87.63]
3.650
[92.71]
3.850
[97.79]
4.450
[113.03]
4.950
[125.73]
C
1.400
[35.56]
2.300
[58.42]
2.400
[60.96]
2.900
[73.66]
3.100
[78.74]
3.300
[83.82]
3.900
[113.03]
4.400
[111.76]
D
1.550
[39.37]
2.300
[62.23]
2.550
[64.77]
3.050
[77.47]
3.250
[82.55]
3.450
[87.63]
4.050
[102.87]
4.550
[115.57]
Description
HDC-H150-31XX-XXXX
HDC-H165-31XX-XXXX
HDC-H180-31XX-XXXX
HDC-H195-31XX-XXXX
HDC-H210-31XX-XXXX
HDC-H225-31XX-XXXX
HDC-H228-31XX-XXXX
HDC-H240-31XX-XXXX
Pin
Quantity
150
165
180
195
210
225
228
240
A
5.750
[146.05]
6.250
[158.75]
6.750
[171.45]
7.250
[184.15]
7.750
[196.85]
8.250
[209.55]
8.350
[212.09]
8.750
[222.25]
B
5.450
[138.43]
5.950
[151.13]
6.450
[163.83]
6.950
[176.53]
7.450
[189.23]
7.950
[201.93]
8.050
[204.47]
8.450
[214.63]
HDC Series
C
4.900
[124.46]
5.400
[137.16]
5.900
[149.86]
6.400
[162.56]
6.900
[175.26]
7.400
[187.96]
7.500
[190.50]
7.900
[200.66]
D
5.050
[128.27]
5.550
[140.97]
6.050
[153.67]
6.550
[166.37]
7.050
[179.07]
7.550
[191.77]
7.650
[194.31]
8.050
[204.47]
Plating Description
Ordering Information
HDC - HXXX - XXXX - XXXX
Plating Chart (S1 & P1 Termination Styles ONLY)
Pin Quantity:
See Table
Row Options
3 = 3 Rows
4 = 4 Rows
Plating
Options:
(See Plating
Chart)
Plating
Suffix
TR
TG30
Press-Fit
Terminations
(RIA E2 & C2
apply)
(RIA E2 & C2
apply)
(RIA E1 & C1
apply)
(RIA E1 & C1
apply)
Solder Tail
Terminations
(RIA E3 & C2
apply)
(RIA E3 & C2
apply)
(RIA E1 & C1
apply)
(RIA E1 & C1
apply)
Plating composition
3 μ” [0.08 μm] Min. Au over
7 μ” [0.18 μm] PdNi area 1
100 μ” [2.54 μm] Min. Tin Lead area 4
50 μ” [1.27 μm] Min. Ni all over
30 μ” [0.76 μm] Min. Au Area 1
100 μ” [2.54 μm] Min. Tin Lead Tail Area 4
50 μ” [1.27 μm] Min. Ni all over
3 μ” [0.08 μm] Min Au on Area 1
7 μ” [0.18 μm] PdNi on area 1
100 μ” [2.54 μm] Min. Whisker Mitigating
Matte Tin on Area 4
50 μ” [1.27 μm] Min. Ni all over
30 μ” [0.76 μm] Min. Au on Area 1
100 μ” [5.08 μm] Min. Whisker Mitigating
Matte Tin on Area 4
50 μ” [1.27 μm] Min. Ni all over
HM
Insulator Options
1 = Single bay
insulator
2 = Dual bay
insulator
KR
Plating Chart (P2 Termination Styles ONLY)
Plating
Suffix
GG30
Press-Fit
Terminations
(RIA E2 & C2
apply)
(RIA E2 & C2
apply)
Solder Tail
Terminations
(RIA E3 & C2
apply)
(RIA E3 & C2
apply)
Plating composition
30 μ” [0.76 μm] Min. Au on area 1
10 μ” [0.25 μm] Min. Au on area 2
100 μ” [2.54 μm] Min Tin Lead on area 3
50 μ” [1.27 μm] Ni all over
30 μ” [0.76 μm] Min. Au on area 1
10 μ” [0.25 μm] Min. Au on area 2
100 μ” [2.54 μm] Min Tin Lead on area 3
50 μ” [1.27 μm] Ni all over
Termination Style / Lead length - Dim. F
P1 - Press-fit / 0.200″ (5.08)
P2 - Press-fit / 0.533″ (13.54)
S1 - Solder Tail / 0.190″ (4.83)
RR
TS-1136-C
Sheet 3 of 7
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
HDC Header
.100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit
Inch
[mm]
HDC Series
A
8.650
[219.71]
9.050
[229.87]
9.650
[245.11]
10.250
[260.35]
10.850
[275.59]
11.450
[290.83]
12.050
[306.07]
12.650
[321.31]
13.250
[336.55]
B
8.350
[212.09]
8.750
[222.25]
9.350
[237.49]
9.950
[252.73]
10.550
[267.97]
11.150
[283.21]
11.750
[298.45]
12.350
[313.69]
12.950
[328.93]
C
7.800
[198.12]
8.200
[208.28]
8.800
[223.52]
9.400
[238.76]
10.000
[254.00]
10.600
[269.24]
11.200
[284.48]
11.800
[299.72]
12.400
[314.96]
D
7.950
[201.93]
8.350
[212.09]
8.950
[227.33]
9.550
[242.57]
10.150
[257.81]
10.750
[273.05]
11.350
[288.29]
11.950
[303.53]
12.550
[318.77]
E
3.700
[93.98]
3.900
[99.06]
4.200
[106.68]
4.500
[114.30]
4.800
[121.92
5.100
[129.54]
5.400
[137.16]
5.700
[144.78]
6.000
[152.40]
Product Table/Dimensions for 3 Row, Dual Bay
Description
HDC-H228-32XX-XXXX
HDC-H240-32XX-XXXX
HDC-H258-32XX-XXXX
HDC-H276-32XX-XXXX
HDC-H294-32XX-XXXX
HDC-H312-32XX-XXXX
HDC-H330-32XX-XXXX
HDC-H348-32XX-XXXX
HDC-H366-32XX-XXXX
Pin
Quantity
228
240
258
276
294
312
330
348
366
Tolerance Unless Noted
.0
.00
Inch
±.1
±.01
.000
±.005
[ ] Dimensions for
Reference only
TS-1136-C
Sheet 4 of 7
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
HDC Header
.100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit
4-Row Single Bay
HDC Series
TS-1136-C
Sheet 5 of 7
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
MEMS传感器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
