SKYPER 42 R
Absolute Maximum Ratings
Symbol
V
s
V
iH
V
iL
Iout
PEAK
Iout
AVmax
f
max
Conditions
Supply voltage primary
Input signal voltage (HIGH)
Input signal voltage (LOW)
Output peak current
Output average current
Max. switching frequency
Collector emitter voltage sense across
the IGBT
Rate of rise and fall of voltage
secondary to primary side
Isolation test voltage input - output (AC,
rms, 2s)
Partial discharge extinction voltage,
rms, Q
PD
10pC
Isolation test voltage output 1 - output 2
(AC, rms, 2s)
Minimum rating for external R
Gon
Minimum rating for external R
Goff
Max. rating for output charge per pulse
Operating temperature
Storage temperature
Values
16
Vs + 0.3
GND - 0.3
30
150
100
1700
100
4000
1500
1500
0.8
0.8
50
-40 ... 85
-40 ... 85
Unit
V
V
V
A
mA
kHz
V
kV/µs
V
V
V
:
:
µC
°C
°C
SKYPER
®
IGBT Driver Core
SKYPER 42 R
Preliminary Data
V
CE
dv/dt
V
isol IO
V
isolPD
V
isol12
Features
•
•
•
•
•
•
•
•
Two output channels
Integrated potential free power supply
Under voltage protection
Drive interlock top / bottom
Dynamic short cirucit protection
Shut down input
Failure management
IEC 60068-1 (climate) 40/085/56, no
condensation and no dripping water
permitted, non-corrosive, climate class
3K3 acc. EN60721
R
Gon min
R
Goff min
Q
out/pulse
T
op
T
stg
Characteristics
Symbol
V
s
Conditions
Supply voltage primary side
Supply current primary (no load)
Supply current primary side (max.)
Input signal voltage on / off
Input treshold voltage HIGH
Input threshold voltage (LOW)
Input resistance (switching/HALT
signal)
Turn on output voltage
Turn off output voltage
Asic system switching frequency
Input-output turn-on propagation time
Input-output turn-off propagation time
Error input-output propagation time
Top-Bot interlock dead time
Coupling capacitance prim sec
weight
min.
14.4
typ.
15
125
max.
15.6
800
Unit
V
mA
mA
V
V
V
Typical Applications*
• Driver for IGBT modules in bridge
circuits in industrial application
• DC bus voltage up to 1200V
I
SO
V
i
V
IT+
V
IT-
15 / 0
12.3
4.6
10
15
-8
8
1.1
1.1
2.3
9
2
3
Footnotes
Isolation test voltage with external high
voltage diode
The isolation test is not performed as a
series test at SEMIKRON
The driver power can be expanded to 50µC
with external boost capacitors
Isolation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00
R
IN
V
G(on)
V
G(off)
f
ASIC
t
d(on)IO
t
d(off)IO
t
d(err)
t
TD
C
ps
w
k:
V
V
MHz
µs
µs
µs
µs
µs
pF
g
t
pERRRESET
Error reset time
MTBF
2.1
10
6
h
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1,
Chapter IX
* The specifications of our components may not be considered as an assurance of component
characteristics. Components have to be tested for the respective application. Adjustments may
be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly
recommend prior consultation of our staff.
Driver Core
© by SEMIKRON
Rev. 5 – 05.04.2011
1
SKYPER
®
42 R
Technical Explanations
Revision
Status:
Prepared by:
05
preliminary
Johannes Krapp
Related Documents:
title:
Data Sheet SKYPER 42 R
This Technical Explanation is valid for the following parts:
part number:
date code (YYWW):
L5054301
>CW16
SKYPER
®
42 R
Content
1.
2.
2.1.
2.2.
3.
3.1.
3.2.
3.3.
3.4.
3.5.
3.6.
3.7.
3.8.
3.9.
4.
4.1.
4.2.
4.3.
4.4.
4.5.
5.
5.1.
5.2.
6.
7.
Introduction .............................................................................................................................................. 2
Application and Handling Instructions.................................................................................................. 3
General Instructions ................................................................................................................................... 3
Mechanical Instructions ............................................................................................................................. 3
Driver Interface ........................................................................................................................................ 5
Controller Interface – Primary Side Pinning .............................................................................................. 5
Controller Interface – Primary Side Connection ........................................................................................ 6
Module interface – Secondary Side ........................................................................................................... 7
Module interface – Secondary Side Connection ....................................................................................... 8
Power supply - Primary.............................................................................................................................. 9
Gate driver signals – Primary .................................................................................................................... 9
Shut Down Input (SDI) - Primary ............................................................................................................. 10
Gate resistors - Secondary ...................................................................................................................... 10
External Boost Capacitors (BC) -Secondary ........................................................................................... 11
Protection features ................................................................................................................................ 11
Failure Management ................................................................................................................................ 11
Under Voltage Protection of driver power supply (UVP) ......................................................................... 12
Short Pulse Suppression (SPS) .............................................................................................................. 12
Dead Time generation (Interlock TOP / BOT) (DT) ................................................................................. 12
Dynamic Short Circuit Protection by VCEsat monitoring (DSCP) ........................................................... 13
Electrical Characteristic ........................................................................................................................ 15
Driver Performance.................................................................................................................................. 15
Insulation ................................................................................................................................................. 15
Environmental Conditions .................................................................................................................... 16
Marking ................................................................................................................................................... 17
1
2011-04-04 – Rev05
© by SEMIKRON
SKYPER
®
42 R
Please note:
Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in
large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating
parameters should be validated by user’s technical experts for each application.
1. Introduction
The SKYPER 42 core constitutes an interface between IGBT modules and the controller. This core is a half
bridge driver. Basic functions for driving, potential separation and protection are integrated in the driver. Thus it
can be used to build up a driver solution for IGBT modules. SKYPER 42 R is developed for systems in the
power range of 1 MVA – 8 MVA.
Two output channels
Up to 50 µC gate charge
Integrated potential free power supply for the secondary side
Short Pulse Suppression (SPS)
Under Voltage Protection (UVP)
Drive interlock (dead time) top / bottom (DT)
Dynamic Short Circuit Protection (DSCP) by V
CE
monitoring and
direct switch off
Shut Down Input (SDI)
Failure Management
Expandable by External Boost Capacitors (BC)
DC bus voltage up to 1200V
SKYPER 42 R
Block diagram of SKYPER 42 R
2
2011-04-04 – Rev05
© by SEMIKRON
SKYPER
®
42 R
2. Application and Handling Instructions
2.1. General Instructions
Please provide for static discharge protection during handling. As long as the driver is not completely
assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a
grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during
transportation the input terminals have to be short-circuited using, for example, conductive rubber.
Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and
load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the
free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will
be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works
correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector
voltage.
2.2. Mechanical Instructions
Dimensions – 69 x 80 x 19 + Holes – bottom view
3
2011-04-04 – Rev05
© by SEMIKRON
SKYPER
®
42 R
For integrating the SKYPER 42 R driver core in to an inverter system an adaptor board has to be built.
SEMIKRON offers a wide range of adaptor boards, e.g. for SEMiX, Semitrans or SKiM modules.
SEMIKRON offers in addition a customer specific adaptor board on demand. Please contact your
responsible sales for further information.
Adaptor boards for SKYPER 42 R
SKYPER 42 R can be plugged or soldered on the adaptor board.
Soldering Hints
The temperature of the solder must not exceed 260° and solder time must not exceed 10 seconds.
C,
The ambient temperature must not exceed the specified maximum storage temperature of the driver.
The solder joints should be in accordance to IPC A 610 Revision D (or later) - Class 3 (Acceptability of Electronic Assemblies) to
ensure an optimal connection between driver core and printed circuit board.
The driver is not suited for hot air reflow or infrared reflow processes.
Use of Support Posts
The connection between driver core and printed circuit
board should be mechanical reinforced by using support
posts.
The driver board has got three holes for supports posts.
Using support posts with external screw thread improves
mechanical assembly.
Product information of suitable support posts and
distributor contact information is available at e.g.
http://www.richco-inc.com or http://www.ettinger.de.
4
2011-04-04 – Rev05
© by SEMIKRON
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