SKYPER 32 R UL
Absolute Maximum Ratings
Symbol
V
s
V
iH
V
iL
Iout
PEAK
Iout
AVmax
f
max
Conditions
Supply voltage primary
Input signal voltage (HIGH)
Input signal voltage (LOW)
Output peak current
Output average current
Max. switching frequency
Collector emitter voltage sense across
the IGBT
Rate of rise and fall of voltage
secondary to primary side
Isolation test voltage input - output
(AC, rms, 2s)
Partial discharge extinction voltage,
rms, Q
PD
d
10pC
Isolation test voltage output 1 - output
2 (AC, rms, 2s)
Minimum rating for external R
Gon
Minimum rating for external R
Goff
Max. rating for output charge per pulse
Operating temperature
Storage temperature
Values
16
Vs + 0.3
GND - 0.3
15
50
50
1700
50
4000
1500
1500
1.5
1.5
2.5
-40 ... 85
-40 ... 85
Unit
V
V
V
A
mA
kHz
V
kV/µs
V
V
V
:
:
µC
°C
°C
SKYPER
®
IGBT Driver Core
SKYPER 32 R UL
Preliminary Data
V
CE
dv/dt
V
isol IO
V
isolPD
V
isol12
Features
•
•
•
•
•
•
•
•
•
•
UL recognized according UL 508C
UL report reference E242581
Two output channels
Integrated potential free power supply
Under voltage protection
Drive interlock top / bottom
Dynamic short cirucit protection
Shut down input
Failure management
IEC 60068-1 (climate) 40/085/56, no
condensation and no dripping water
permitted, non-corrosive, climate class
3K3 acc. EN60721
R
Gon min
R
Goff min
Q
out/pulse
T
op
T
stg
Characteristics
Symbol
V
s
I
SO
V
i
V
IT+
V
IT-
R
IN
Conditions
Supply voltage primary side
Supply current primary (no load)
Supply current primary side (max.)
Input signal voltage on / off
Input treshold voltage HIGH
Input threshold voltage (LOW)
Input resistance (switching/HALT
signal)
Turn on output voltage
Turn off output voltage
Asic system switching frequency
Input-output turn-on propagation time
Input-output turn-off propagation time
Error input-output propagation time
Top-Bot interlock dead time
Coupling capacitance prim sec
min.
14.4
typ.
15
80
max.
15.6
450
Unit
V
mA
mA
V
V
V
Typical Applications*
• Driver for IGBT modules in bridge
circuits in industrial application
• DC bus voltage up to 1200V
15 / 0
12.3
4.6
10
15
-7
8
1.1
1.1
5.4
9
3
12
28
4.3
7.9
k:
V
V
MHz
µs
µs
µs
µs
µs
pF
g
Footnotes
V
CE:
With external high voltage diode
V
isolIO/
V
isol12
: Isolation test is not performed
as a series test at SEMIKRON and must be
performed by the user
V
isolPD
: According to VDE 0110-20
Q
out/pulse
can be expanded to 6,3µQ with
boost capacitors
Isolation coordination in compliance with
EN50178 PD2
Operating temperature is real ambient
temperature around the driver core
Degree of protection: IP00
V
G(on)
V
G(off)
f
ASIC
t
d(on)IO
t
d(off)IO
t
d(err)
t
TD
C
ps
w
t
pERRRESET
Error reset time
MTBF
Mean Time Between Failure Ta = 40°C
2.5
10
6
h
This is an electrostatic discharge sensitive device (ESDS), international standard IEC
60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component
characteristics. Components have to be tested for the respective application. Adjustments
may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly
recommend prior consultation of our personal.
Driver Core
© by SEMIKRON
Rev. 0 – 11.08.2010
1
SKYPER
®
32 R UL
Technical Explanations
Revision
Status:
Prepared by:
00
Johannes Krapp
Related Documents:
title:
Data Sheet SKYPER 32 R UL
This Technical Explanation is valid for the following parts:
part number:
date code (YYWW):
L6100104
≥
1030
SKYPER
®
32 R UL
Content
Application and Handling Instructions .................................................................................................................... 2
Further application support ..................................................................................................................................... 2
General Description ................................................................................................................................................ 2
Features of SKYPER 32 R UL................................................................................................................................ 2
UL specified remarks .............................................................................................................................................. 3
Block diagram ......................................................................................................................................................... 3
Dimensions ............................................................................................................................................................. 3
PIN Array – Primary Side........................................................................................................................................ 4
PIN Array – Secondary Side................................................................................................................................... 5
Driver Performance................................................................................................................................................. 6
Insulation................................................................................................................................................................. 6
Isolation Test Voltage ............................................................................................................................................. 7
Auxiliary Power Supply ........................................................................................................................................... 7
Under Voltage Protection of driver power supply (UVP) ........................................................................................ 8
Input Signals ........................................................................................................................................................... 8
Short Pulse Suppression (SPS) ............................................................................................................................. 8
Failure Management............................................................................................................................................... 9
Shut Down Input (SDI)............................................................................................................................................ 9
Dead Time generation (Interlock TOP / BOT) (DT).............................................................................................. 10
Dynamic Short Circuit Protection by V
CEsat
monitoring / de-saturation monitoring (DSCP).................................. 10
Adjustment of DSCP............................................................................................................................................. 11
High Voltage Diode for DSCP............................................................................................................................... 12
Gate resistors ....................................................................................................................................................... 12
External Boost Capacitors (BC)............................................................................................................................ 13
Application Example ............................................................................................................................................. 13
Mounting Notes..................................................................................................................................................... 14
Environmental Conditions..................................................................................................................................... 14
Marking ................................................................................................................................................................. 15
1
Rev 0 – 11.08.2010
© by SEMIKRON
SKYPER
®
32 R UL
Please note:
Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in
large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating
parameters should be validated by user’s technical experts for each application.
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubbers between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
S
+0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at
http://www.semikron.com.
For design support please read the SEMIKRON Application
Manual Power Modules available at
http://www.semikron.com.
General Description
The SKYPER 32 core constitutes an interface between IGBT modules and the controller. The driver is developed according
to the requirements of UL standard. This core is a half bridge driver. Basic functions for driving, potential separation and
protection are integrated in the driver. Thus it can be used to build up a driver solution for IGBT modules.
Features of SKYPER 32 R UL
Two output channels
Integrated potential free power supply for the secondary side
Short Pulse Suppression (SPS)
Under Voltage Protection (UVP)
Drive interlock (dead time) top / bottom (DT)
Dynamic Short Circuit Protection (DSCP) by V
CE
monitoring and direct
switch off
Shut Down Input (SDI)
Failure Management
Expandable by External Boost Capacitors (BC)
DC bus voltage up to 1200V
SKYPER 32
2
Rev 0 – 11.08.2010
© by SEMIKRON
SKYPER
®
32 R UL
UL specified remarks
The equipment shall be installed in compliance with the mounting and spacing requirements of the end-use application.
SKYPER 32 shall be supplied by an isolated limited voltage / limited current source or a Class 2 source. The 15 A peak
rating is an instantaneous peak rating only.
These devices do not incorporate solid-state motor overload protection. The need for overload protection and over-
current protection devices shall be determined in the end-use product.
These devices have not been evaluated to over-voltage, over-current, and over-temperature control, and may need to
be subjected to the applicable end-product tests.
Temperature and tests shall be considered in the end use. Due to the limited current source, only the effect of heat
generating components in this device on adjacent components in the end product needs to be considered.
Connectors have not been evaluated field wiring; all connections are to be factory wired only.
Block diagram
Block diagram
Dimensions
Dimensions in mm (bottom view)
(top view)
±0,2mm unless otherwise noted
3
Rev 0 – 11.08.2010
10,3
10,3
© by SEMIKRON
SKYPER
®
32 R UL
PIN Array – Primary Side
Connectors
Connector X10 (RM2,54, 10pin)
±0,25mm unless otherwise noted
PIN
X10:01
X10:02
Signal
PRIM_PWR_GND
PRIM_PWR_GND
Function
GND for power supply and GND for digital
signals
GND for power supply and GND for digital
signals
ERROR output
ERROR input
GND for power supply and GND for digital
signals
GND for power supply and GND for digital
signals
Switching signal input (TOP switch)
Specification
X10:03
X10:04
X10:05
X10:06
PRIM_nERROR_OUT
PRIM_nERROR_IN
PRIM_PWR_GND
PRIM_PWR_GND
LOW = NO ERROR; open collector output;
max. 30V / 15mA
(external pull up resistor necessary)
5V logic; LOW active
X10:07
PRIM_TOP_IN
Digital 15 V; 10 kOhm impedance;
LOW = TOP switch off;
HIGH = TOP switch on
Digital 15 V; 10 kOhm impedance;
LOW = BOT switch off;
HIGH = BOT switch on
Stabilised +15V ±4%
Stabilised +15V ±4%
X10:08
X10:09
X10:10
PRIM_BOT_IN
PRIM_PWR_15P
PRIM_PWR_15P
Switching signal input (BOTTOM switch)
Drive core power supply
Drive core power supply
4
Rev 0 – 11.08.2010
© by SEMIKRON
玄铁RISC-V活动专区
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
