SKYPER 32 R ...
Absolute Maximum Ratings
Symbol Conditions
Values
Units
SKYPER
TM
IGBT Driver Core
SKYPER 32 R
Preliminary Data
Features
Characteristics
Symbol Conditions
min.
typ.
max.
Units
Typical Applications
1)
2)
3)
4)
This technical information specifies semiconductor devices but promises no
characteristics. No warranty or guarantee expressed or implied is made regarding
delivery, performance or suitability.
1
19-01-2007 MHW
© by SEMIKRON
SKYPER™ 32 R
Technical Explanations
Revision
Status:
Prepared by:
05
preliminary
Markus Hermwille
Related Documents:
title:
version:
Data Sheet SKYPER 32 R
2007-01-19
This Technical Explanation is valid for the following parts:
part number:
date code (YYWW):
L6100102
≥
0705
SKYPER™ 32 R
Content
Application and Handling Instructions....................................................................................................................................... 3
Further application support....................................................................................................................................................... 3
General Description.................................................................................................................................................................. 3
Features of SKYPER™ 32 ....................................................................................................................................................... 3
Block diagram........................................................................................................................................................................... 4
Dimensions............................................................................................................................................................................... 4
PIN Array – Primary Side ......................................................................................................................................................... 5
PIN Array – Secondary Side..................................................................................................................................................... 6
Driver Performance .................................................................................................................................................................. 7
Insulation .................................................................................................................................................................................. 7
Isolation Test Voltage ............................................................................................................................................................... 8
Auxiliary Power Supply............................................................................................................................................................. 8
Under Voltage Protection of driver power supply (UVP)........................................................................................................... 9
Input Signals............................................................................................................................................................................. 9
Short Pulse Suppression (SPS) ............................................................................................................................................... 9
Failure Management............................................................................................................................................................... 10
Shut Down Input (SDI)............................................................................................................................................................ 10
Dead Time generation (Interlock TOP / BOT) (DT) ................................................................................................................ 11
Dynamic Short Circuit Protection by V
CEsat
monitoring / de-saturation monitoring (DSCP)..................................................... 11
Adjustment of DSCP............................................................................................................................................................... 12
High Voltage Diode for DSCP ................................................................................................................................................ 13
Gate resistors ......................................................................................................................................................................... 13
External Boost Capacitors (BC).............................................................................................................................................. 14
Application Example ............................................................................................................................................................... 14
Mounting Notes ...................................................................................................................................................................... 15
Environmental Conditions....................................................................................................................................................... 15
Marking................................................................................................................................................................................... 16
2
2007-01-19 – Rev05
© by SEMIKRON
SKYPER™ 32 R
Please note:
Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in
large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating
parameters should be validated by user’s technical experts for each application.
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubbers between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
S
+0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at
http://www.semikron.com.
For design support please read the SEMIKRON Application
Manual Power Modules available at
http://www.semikron.com.
General Description
The SKYPER™ 32 core constitutes an interface between IGBT modules and the controller. This core is a half bridge driver.
Basic functions for driving, potential separation and protection are integrated in the driver. Thus it can be used to build up a
driver solution for IGBT modules.
Features of SKYPER™ 32
Two output channels
Integrated potential free power supply for the secondary side
Short Pulse Suppression (SPS)
Under Voltage Protection (UVP)
Drive interlock (dead time) top / bottom (DT)
Dynamic Short Circuit Protection (DSCP) by V
CE
monitoring and direct
switch off
Shut Down Input (SDI)
Failure Management
Expandable by External Boost Capacitors (BC)
DC bus voltage up to 1200V
SKYPER™ 32
3
2007-01-19 – Rev05
© by SEMIKRON
SKYPER™ 32 R
Block diagram
Block diagram
Dimensions
Dimensions in mm (bottom view)
(top view)
±0,2mm unless otherwise noted
4
2007-01-19 – Rev05
10,3
10,3
© by SEMIKRON
SKYPER™ 32 R
PIN Array – Primary Side
Connectors
Connector X10 (RM2,54, 10pin)
±0,25mm unless otherwise noted
PIN
X10:01
X10:02
Signal
PRIM_PWR_GND
PRIM_PWR_GND
Function
GND for power supply and GND for digital
signals
GND for power supply and GND for digital
signals
ERROR output
ERROR input
GND for power supply and GND for digital
signals
GND for power supply and GND for digital
signals
Switching signal input (TOP switch)
Specification
X10:03
X10:04
X10:05
X10:06
PRIM_nERROR_OUT
PRIM_nERROR_IN
PRIM_PWR_GND
PRIM_PWR_GND
LOW = NO ERROR; open collector output;
max. 30V / 15mA
(external pull up resistor necessary)
5V logic; LOW active
X10:07
PRIM_TOP_IN
Digital 15 V; 10 kOhm impedance;
LOW = TOP switch off;
HIGH = TOP switch on
Digital 15 V; 10 kOhm impedance;
LOW = BOT switch off;
HIGH = BOT switch on
Stabilised +15V ±4%
Stabilised +15V ±4%
X10:08
X10:09
X10:10
PRIM_BOT_IN
PRIM_PWR_15P
PRIM_PWR_15P
Switching signal input (BOTTOM switch)
Drive core power supply
Drive core power supply
5
2007-01-19 – Rev05
© by SEMIKRON
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