TS4B01G thru TS4B07G
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Glass passivated junction
- Ideal for printed circuit board
- High case dielectric strength of 2000VRMS
- Reliable low cost construction
- UL Recognized File # E-326243
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Glass Passivated Bridge Rectifiers
TS4B
MECHANICAL DATA
Case:
TS4B
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Polarity:
Polarity as marked on the body
Mounting torque:
5 in-lbs maximum
Weight:
4 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Rating for fusing (t<8.3ms)
Maximum instantaneous forward voltage (Note 1)
@2A
@4A
Maximum DC reverse current
at rated DC blocking voltage
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
T
J
=25
℃
T
J
=125℃
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
I
2
t
V
F
TS4B
01G
50
35
50
TS4B
02G
100
70
100
TS4B
03G
200
140
200
TS4B
04G
400
280
400
4
120
60
1.0
1.1
5
500
5.5
- 55 to +150
- 55 to +150
O
TS4B
05G
600
420
600
TS4B
06G
800
560
800
TS4B
07G
1000
700
1000
UNIT
V
V
V
A
A
A
2
s
V
I
R
R
θJC
T
J
T
STG
μA
C/W
O
O
C
C
Document Number: DS_D1311042
Version: F13
TS4B01G thru TS4B07G
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PACKING CODE
C2
X0
D2
Suffix "G"
GREEN COMPOUND
CODE
TS4B0xG
(Note 1)
TS4B
TS4B
TS4B
20 / TUBE
Forming
20 / TUBE
PACKAGE
PACKING
Note 1: "x" defines voltage from 50V (TS4B01G) to 1000V (TS4B07G)
EXAMPLE
PREFERRED P/N
TS4B01G C2
TS4B01G C2G
PART NO.
TS4B01G
TS4B01G
PACKING CODE
C2
C2
G
Green compound
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG.1- MAXIMUM FORWARD CURRENT
DERATING CURVE
5
4
3
2
1
0
0
50
100
150
CASE TEMPERATURE (
o
C)
INSTANTANEOUS REVERSE CURRENT (μA)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
100
TJ=100℃
AVERAGE FORWARD
A
CURRENT (A)
10
1
TJ=25℃
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
175
PEAK FORWARD SURGE CURRENT (A)
150
125
100
75
50
25
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
8.3ms Single Half Sine Wave
JEDEC Method
10
FIG. 4- TYPICAL FORWARD CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT (A)
1
0.1
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
INSTANTANEOUS FORWARD VOLTAGE (V)
Document Number: DS_D1311042
Version: F13
TS4B01G thru TS4B07G
Taiwan Semiconductor
FIG. 5- TYPICAL JUNCTION CAPACITANCE
1000
J UNCTION CAPACITANCE (pF)
A
900
800
700
600
500
400
300
200
100
0
0.1
1
10
100
1000
REVERSE VOLTAGE (V)
f=1.0MHz
Vsig=50mVp-p
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
24.70
0.90
1.80
14.70
3.96
17.00
7.30
3.30
3.10
9.30
1.52
0.55
Max
25.30
1.10
2.20
15.30
4.37
18.00
7.70
3.70
3.40
9.70
1.73
0.75
Unit (inch)
Min
0.972
0.035
0.071
0.579
0.156
0.669
0.287
0.130
0.122
0.366
0.060
0.022
Max
0.996
0.043
0.087
0.602
0.172
0.709
0.303
0.146
0.134
0.382
0.068
0.030
DIM.
A
B
C
D
E
F
G
H
I
J
K
L
MARKING DIAGRAM
P/N
G
YWW
F
= Specific Device Code
= Green Compound
= Date Code
= Factory Code
Document Number: DS_D1311042
Version: F13
TS4B01G thru TS4B07G
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1311042
Version: F13
Microchip MCU
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