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CM8870SI

产品描述DTMF Signaling Circuit, CMOS, PDSO18, SOIC-18
产品类别无线/射频/通信    电信电路   
文件大小227KB,共8页
制造商California Micro Devices
下载文档 详细参数 选型对比 全文预览

CM8870SI概述

DTMF Signaling Circuit, CMOS, PDSO18, SOIC-18

CM8870SI规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称California Micro Devices
零件包装代码SOIC
包装说明SOP, SOP18,.4
针数18
Reach Compliance Codeunknown
JESD-30 代码R-PDSO-G18
JESD-609代码e0
长度11.58 mm
功能数量1
端子数量18
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP18,.4
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
座面最大高度2.85 mm
最大压摆率7 mA
标称供电电压5 V
表面贴装YES
技术CMOS
电信集成电路类型DTMF SIGNALING CIRCUIT
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.635 mm

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CALIFORNIA MICRO DEVICES
CM8870/70C
CMOS Integrated DTMF Receiver
Features
• Full DTMF receiver
• Less than 35mW power consumption
• Industrial temperature range
• Uses quartz crystal or ceramic resonators
• Adjustable acquisition and release times
• 18-pin DIP, 18-pin DIP EIAJ, 18-pin SOIC, 20-pin
PLCC
CM8870C
Power down mode
Inhibit mode
Buffered OSC3 output (PLCC package only)
Applications
• PABX
• Central office
• Mobile radio
• Remote control
• Remote data entry
• Call limiting
• Telephone answering systems
• Paging systems
• CM8870C is fully compatible with CM8870 for 18-pin
devices by grounding pins 5 and 6
Product Description
The CAMD CM8870/70C provides full DTMF receiver capability by integrating both the bandsplit filter and digital
decoder functions into a single 18-pin DIP, SOIC, or 20-pin PLCC package. The CM8870/70C is manufactured using
state-of-the-art CMOS process technology for low power consumption (35mW, max.) and precise data handling. The
filter section uses a switched capacitor technique for both high and low group filters and dial tone rejection. The
CM8870/70C decoder uses digital counting techniques for the detection and decoding of all 16 DTMF tone pairs into a
4-bit code. This DTMF receiver minimizes external component count by providing an on-chip differential input ampli-
fier, clock generator, and a latched three-state interface bus. The on-chip clock generator requires only a low cost TV
crystal or ceramic resonator as an external component.
© 2000 California Micro Devices Corp. All rights reserved.
9/28/2000
+##'
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
215 Topaz Street, Milpitas, California 95035
1

CM8870SI相似产品对比

CM8870SI CM8870CS CM8870CP CM8870P CM8870FI CM8870PE CM8870F
描述 DTMF Signaling Circuit, CMOS, PDSO18, SOIC-18 DTMF Signaling Circuit, CMOS, PDSO18, SOIC-18 DTMF Signaling Circuit, CMOS, PDIP18, PLASTIC, DIP-18 DTMF Signaling Circuit, CMOS, PDIP18, PLASTIC, DIP-18 DTMF Signaling Circuit, CMOS, PDSO18, EIAJ, PLASTIC, SOP-18 DTMF Signaling Circuit, CMOS, PQCC20, PLASTIC, LCC-20 DTMF Signaling Circuit, CMOS, PDSO18, EIAJ, PLASTIC, SOP-18
厂商名称 California Micro Devices California Micro Devices California Micro Devices California Micro Devices California Micro Devices California Micro Devices California Micro Devices
零件包装代码 SOIC SOIC DIP DIP SOIC QLCC SOIC
包装说明 SOP, SOP18,.4 SOP, SOP18,.4 DIP, DIP18,.3 DIP, DIP18,.3 SOP, SOP18,.4 QCCJ, LDCC20,.4SQ SOP, SOP18,.4
针数 18 18 18 18 18 20 18
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
JESD-30 代码 R-PDSO-G18 R-PDSO-G18 R-PDIP-T18 R-PDIP-T18 R-PDSO-G18 S-PQCC-J20 R-PDSO-G18
功能数量 1 1 1 1 1 1 1
端子数量 18 18 18 18 18 20 18
最高工作温度 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP DIP DIP SOP QCCJ SOP
封装等效代码 SOP18,.4 SOP18,.4 DIP18,.3 DIP18,.3 SOP18,.4 LDCC20,.4SQ SOP18,.4
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE CHIP CARRIER SMALL OUTLINE
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大压摆率 7 mA 7 mA 7 mA 7 mA 0.007 mA 0.007 mA 0.007 mA
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES NO NO YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
电信集成电路类型 DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING J BEND GULL WING
端子节距 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL QUAD DUAL
宽度 7.635 mm 7.635 mm 7.62 mm 7.62 mm 5.62 mm 8.966 mm 5.62 mm
长度 11.58 mm 11.58 mm 21.97 mm 21.97 mm - 8.966 mm -
座面最大高度 2.85 mm 2.85 mm 4.57 mm 4.57 mm - 4.57 mm -
Base Number Matches - 1 1 1 1 1 1
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