MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Features
♦
♦
♦
♦
♦
♦
♦
♦
0603 Outline
Surface Mount
15µm I-Region Length Devices
No Wirebonds Required
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
M/A-COM Products
V4
Case Style ODS 1314
Description
This device is a silicon, glass PIN diode surmount chip
fabricated with M/A-COM’s patented HMIC
TM
process.
This device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed on the
top of one pedestal and connections to the backside of the
device are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. This vertical
topology provides for exceptional heat transfer. The
topside is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact protection.
These protective coatings prevent damage to the junction
and the anode air-bridge during handling and assembly.
Applications
These packageless devices are suitable for usage in
moderate incident power,
≤
50dBm/C.W. or where the
peak power is
≤
75dBm, pulse width is
≤
1μS, and duty
cycle is
≤
0.01%. Their low parasitic inductance, 0.4 nH,
and excellent RC constant, make these devices a superior
choice for higher frequency switch elements when
compared to their plastic package counterparts
.
Chip Dimensions
DIM
A
B
C
D
E
F
G
Notes:
1) Backside metal: 0.1microns thick.
2) Yellow area with hatch lines indicate backside ohmic gold
contacts.
3) Both devices have same outline dimensions ( A to G).
INCHES
Min
0.060
0.031
0.004
0.019
0.019
0.019
0.029
Max
0.062
0.032
0.008
0.021
0.021
0.021
0.031
Min
1.525
0.775
0.102
0.475
0.475
0.475
0.725
MM
Max
1.575
0.825
0.203
0.525
0.525
0.525
0.775
Absolute Maximum Ratings
1
@T
AMB
= +25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
C.W. Incident Power
Mounting Temperature
Absolute Maximum
500 mA
- 115 V
-55°C to +125°C
-55 °C to +150°C
+175°C
50dBm
+280°C for 30 seconds
1) Exceeding these limits may cause in permanent damage
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
M/A-COM Products
V4
Electrical Specifications @ T
A
= 25°C
(unless otherwise noted)
Parameter
Symbol
Conditions
Units
Min
Typ
Max
Min
Typ
Max
MADP-017015
Capacitance
Capacitance
Capacitance, 85°C
Resistance
Resistance
Resistance, 85°C
Resistance, 85°C
Forward Voltage
Reverse Leakage
Current
Third Order
Intercept Point
Thermal
Resistance
Lifetime
C
T
C
T
C
T
R
S
R
S
R
S
R
S
V
F
I
R
-40 V, 1 MHz
1,3
-40V, 1 GHz
1,3
-40 V, 1 GHz
1,3
+10 mA, 1 GHz
2,3
+70 mA, 1 GHz
2,3
+10 mA, 1 GHz
2,3
+70 mA, 1 GHz
2,3
+10 mA
-115 V
F1= 1800 MHz
F2 = 1810 MHz
Input Power = 0 dBm
I bias = +70 mA
pF
pF
pF
Ω
Ω
Ω
Ω
V
uA
0.32
0.31
0.29
0.72
0.51
1.08
0.84
0.74
-
0.90
10
0.38
MADP-030015
0.79
0.78
0.76
0.49
0.38
0.82
0.69
0.72
-
-
37.0
0.90
10
0.85
IP3
dBc
-36.8
θ
T
L
+10 mA / -6 mA
( 50% - 90% V )
°C/W
uS
30
1.3
13
1.6
Notes:
1) Total capacitance, C
T
, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2) Series resistance R
S
is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
3) Rs and C
T
are measured on an HP4291A Impedance Analyzer with the die mounted in an ODS-186 package .
4) Theta (θ) is measured with the die mounted in an ODS-186 package .
Typical Spice Parameters @ T
AMB
= +25°C
Spice Parameter
Units
MADP-017015-1314
MADP-030015-1314
N
-
1.1
1.1
RS
Ω
1.2
1.1
IS
IK
BV
A
(mA) (Volts)
9.8E-15 14.7
145
8.5E-15 13.9
145
IBV
(μA)
10
10
Ct
(pF)
0.46
1.12
CJO
(pF)
0.10
0.29
VJ
M FC Cpar_Cj
(Volts)
-
-
(F)
0.29 0.50 0.34 3.5E-13
0.18 0.50 0.19 8.2E-13
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
Typical Performance @ T
AMB
= +25°C
Ct vs. V
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0
10.00
MADP-030015
Rs @ 1GHz (ohm)
M/A-COM Products
V4
Rs vs. I
Ct @ 1GHz (pF)
MADP-017015
1.00
MADP-017015
MADP-030015
0.10
0.001
10
20
Voltage (V)
30
40
0.01
Current (A)
0.1
Ct vs. Freq.
1.2
1
0.8
Ct (pF)
0.6
0.4
0.2
MADP-17015
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
0V
10V
40V
0V
10V
40V
MADP-30015
Ls vs. Freq.
0.2
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
0
0.2
0.4
Ls @ 5, 10, 20mA (nH)
MADP-17015
MADP-30015
0.6
0.8
1
1.2
1.4
1.6
1.8
Frequency (GHz)
Rs vs. Freq.
1.2
MADP-017015
1.0
Rs (ohm)
0.8
0.6
0.4
0.2
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Frequency (GHz)
10mA
20mA
Ls @ 1GHz (nH)
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0
Ls vs. I
5m
A
MADP-017015
5m
A
10mA
20mA
MADP-030015
MADP-030015
0.02
0.04
0.06
0.08
0.1
Current (A)
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-017015-1314
MADP-030015-1314
SURMOUNT™ 15μM PIN Diodes
RoHS Compliant
M/A-COM Products
V4
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in
Application Note M538
, “Surface Mounting
Instructions“ and can viewed on the MA-COM website @
www.macom.com
Ordering Information
Gel Pack
MADP-017015-13140G
MADP-030015-13140G
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
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