电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

RSS30-51TT

产品描述IC Socket, SIP30, 30 Contact(s)
产品类别连接器    插座   
文件大小499KB,共4页
制造商Advanced Interconnections Corp
下载文档 详细参数 全文预览

RSS30-51TT概述

IC Socket, SIP30, 30 Contact(s)

RSS30-51TT规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性SIP SOCKET
联系完成配合TIN LEAD OVER NICKEL
联系完成终止TIN LEAD OVER NICKEL
触点材料BERYLLIUM COPPER ALLOY
设备插槽类型IC SOCKET
使用的设备类型SIP30
外壳材料LIQUID CRYSTAL POLYMER
JESD-609代码e0
制造商序列号RSS
触点数30

文档预览

下载PDF文档
SIP Sockets
Table of Models
SIP Sockets
Molded and Peel-A-Way Insulators
Description:
Peel-A-Way
®
Strips (KSS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
®
.005 Typ.
(.13)
Description:
Molded Snap Strips (HSS/HLSS)
Mat’l: Glass Filled Thermoplastic (PPS)
Index: -60°C to 220°C (-76°F to 428°F)
.030 Typ.
(.76)
.095 Typ.
(2.41)
.095 Typ.
(2.41)
Features:
• Available in three body types:
Peel-A-Way
®
Removable Terminal
Carriers, molded Solid Strips, and
molded Snap Strips [breakable at
.100/(2.54mm)].
• Tapered entry for ease of
insertion.
• Multi-finger contacts for reliability.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• Custom configurations available.
Description:
Molded Solid Strips (RNB, RLNB)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Head Above
Plastic
.030 Typ.
(.76)
Head Flush
with Plastic
.095 Typ.
(2.41)
.095 Typ.
(2.41)
HSS/HLSS replaces RSS/RLSS and SS/LSS. RNB/RLNB replaces HNB/HLNB and NB/LNB.
Head Above
Plastic
Head Flush
with Plastic
Options
• Removable tape seal protects plated contact in harsh environments.
Tape Seal - add 3M to end of part number
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
• Material - Silicone Backed Polyimide Film, -74°C to 260°C (-100°F
to 500°F) Intermittent to 371°C (700°F)
• Spray flux without contaminating contact area.
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers.
Dimensional Information
Molded
Body Types
.100 Typ.
(2.54)
.100
(2.54)
A
.095
A Dimension = number of pins X .100/(2.54)
.100
(2.54)
Peel-A-Way
®
Body Types
.100 Typ.
(2.54)
A
A Dimension = [number of pins X .100/(2.54)] + .200/(5.08)
How To Order
KSS
Body Type
RoHS Compliant:
032
-85
M
G
Contact Plating
RoHS Compliant:
KSS - Peel-A-Way
RNB - Molded Solid (head above)
RLNB - Molded Solid (head flush)
HSS* - Molded Snap (head above)
HLSS* - Molded Snap (head flush)
Number of Pins
KSS: 2-100 pos.
HSS/HLSS: 20, 30 or 32 pos.
RNB/RLNB: 3-20, 30 or 32 pos.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16A
*PSS Insulators (HSS/HLSS) are not suitable for high temperature, lead-free (RoHS) solder profiles.
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
免费申请:支持802.15.4和BLE同时运行的恩智浦最新IPv6无线评估板(共100套)
280366申请日期:即日起-2月28日{:1_97:} >>点此进入活动页面,{:1_123:}提交创意,就有机会免费获取1对(2个)恩智浦KW41Z开发套件(ipv6无线评估板),共100套!同时还有机会获得小礼品(200 ......
nmg NXP MCU
开关电源的尖峰干扰及其抑制
摘要:介绍几种抑制尖峰干扰的方法。通过产品试用表明,该方法有一定的实用性。 关键词:纹波滤波器二极管抑制电源纹波会干扰电子设备的正常工作,引起诸如计算机死机、数据处理出错及控制系统 ......
zbz0529 电源技术
TI北京研讨会随想:DM8168——新一代高性能多媒体处理器
2010年8月9日,全球最大的芯片供应商德州仪器 (TI)在新世纪日航饭店举行了“TI技术研讨会(北京)“站的活动。整个研讨会分五个主题会场。在MCU/DSP主题讨论会上,TI公司DSP业务发展经理郑小龙 ......
cocow 单片机
xilinx EDK guide
好东西要分享啊!...
jyl FPGA/CPLD
【颁奖礼】人人都爱易电源——转发有礼!
感谢大家对本次活动的关注与支持,及对本活动进行转发! 活动详情:https://bbs.eeworld.com.cn/TI/201210_SIMPLE_SWITCHER/index.html 接下来为大家揭晓本次活动的获奖者。 一等奖:GONGH ......
EEWORLD社区 模拟与混合信号
STM32一配置SDIO相关寄存器就进入硬件异常
芯片是STM32F103RBT6,下面是主函数: GPIO_DeInit(GPIOC); SDIO_DeInit(); while(1); GPIO_DeInit(GPIOC)这里设置没问题,但进入SDIO_DeInit()函数设置到相关寄存器就会进入异常中 ......
shuijinliuxi stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2377  997  1438  1603  1433  30  34  14  41  43 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved