SKR 16,3 x 18,2 Qu bond
Absolute Maximum Ratings
Symbol
V
RRM
I
F(AV)
i
2
t
I
FSM
T
jmax
Conditions
T
j
= 25 °C, I
R
= 0.4 mA
T
c
= 80 °C, T
j
= 150 °C
T
j
= 150 °C, 10 ms, sin 180°
10 ms
sin 180°
T
j
= 25 °C
T
j
= 150 °C
Values
1600
305
130100
6600
5100
150
Unit
V
A
A
2
s
A
A
°C
DIODE
I
F(DC)
= 365 A
V
RRM
= 1600 V
Size: 16,3 mm x 18,2 mm
Electrical Characteristics
Symbol
I
R
V
F
V
(TO)
r
T
Conditions
T
j
= 25 °C, V
RRM
T
j
= 120 °C, V
RRM
T
j
= 25 °C, I
F
= 320 A
T
j
= 125 °C, I
F
= 320 A
T
j
= 125 °C
T
j
= 125 °C
T
j
= 25 °C, ± 1 A
min.
typ.
max.
0.4
2.2
Unit
mA
mA
V
V
V
mΩ
µs
1
0.9
1.21
1.1
0.83
0.5
SKR 16,3 x 18,2 Qu bond
t
rr
49
Thermal Characteristics
Features
• high current density due to mesa
technology
• high surge current
• compatible to thick wire bonding
• compatible to all standard solder
processes
Symbol
T
j
T
stg
T
solder
T
solder
R
th(j-c)
Conditions
min.
-40
-40
typ.
max.
150
150
250
320
Unit
°C
°C
°C
°C
K/W
10 min.
5 min.
Semipack 2 assembly
0.185
Typical Applications*
• uncontrolled rectifier bridges
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Cathode
Wire bond
Package
Chips /
Package
Conditions
Values
16.3 x 18.2
296.66
bondable (Al)
solderable (Ag/Ni)
Al, diameter
≤
500 µm
tray
20
Unit
mm
2
mm
2
pcs
SKR
© by SEMIKRON
Rev. 1 – 19.02.2010
1
SKR 16,3 x 18,2 Qu bond
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
2
Rev. 1 – 19.02.2010
© by SEMIKRON
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