16-bit dual supply translating transceiver with configurable voltage translation; 3-state
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | BGA |
| 包装说明 | 4.50 X 7 MM, 0.65 MM PITCH, PLASTIC, MO-225, SOT702-1, VFBGA-56 |
| 针数 | 56 |
| 制造商包装代码 | SOT702-1 |
| Reach Compliance Code | _compli |
| 其他特性 | TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B |
| 控制类型 | COMMON CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | AVC |
| JESD-30 代码 | R-PBGA-B56 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 负载电容(CL) | 15 pF |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 最大I(ol) | 0.006 A |
| 湿度敏感等级 | 2 |
| 位数 | 8 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 56 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA56,6X10,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) | 240 |
| 电源 | 1.2/3.3 V |
| Prop。Delay @ Nom-Su | 10.2 ns |
| 传播延迟(tpd) | 10.2 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 |
| 翻译 | 0.8/3.3V&0.8/3.3V |
| 宽度 | 4.5 mm |
| Base Number Matches | 1 |

| 74AVC16T245EV | 74AVC16T245BX | 74AVC16T245DGV | 74AVC16T245DGG | 74AVC16T245 | |
|---|---|---|---|---|---|
| 描述 | 16-bit dual supply translating transceiver with configurable voltage translation; 3-state | 16-bit dual supply translating transceiver with configurable voltage translation; 3-state | 16-bit dual supply translating transceiver with configurable voltage translation; 3-state | 16-bit dual supply translating transceiver with configurable voltage translation; 3-state | 16-bit dual supply translating transceiver with configurable voltage translation; 3-state |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
| 零件包装代码 | BGA | QFN | TSSOP | TSSOP | - |
| 包装说明 | 4.50 X 7 MM, 0.65 MM PITCH, PLASTIC, MO-225, SOT702-1, VFBGA-56 | HVQCCN, LGA60,8X12,20 | TSSOP, | 6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48 | - |
| 针数 | 56 | 60 | 48 | 48 | - |
| Reach Compliance Code | _compli | compli | unknow | unknow | - |
| 其他特性 | TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B | - | TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B | TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B | - |
| 系列 | AVC | AVC | AVC | AVC | - |
| JESD-30 代码 | R-PBGA-B56 | R-PQCC-N60 | R-PDSO-G48 | R-PDSO-G48 | - |
| JESD-609代码 | e0 | - | e4 | e4 | - |
| 长度 | 7 mm | 6 mm | 9.7 mm | 12.5 mm | - |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | - |
| 湿度敏感等级 | 2 | 2 | 1 | 1 | - |
| 位数 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 2 | 2 | 2 | 2 | - |
| 端口数量 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 56 | 60 | 48 | 48 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | VFBGA | HVQCCN | TSSOP | TSSOP | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 峰值回流温度(摄氏度) | 240 | 260 | 260 | 260 | - |
| 传播延迟(tpd) | 10.2 ns | 10.2 ns | 10.2 ns | 10.2 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1 mm | 0.5 mm | 1.1 mm | 1.2 mm | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | - |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
| 端子形式 | BALL | NO LEAD | GULL WING | GULL WING | - |
| 端子节距 | 0.65 mm | 0.5 mm | 0.4 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 20 | 30 | 30 | 30 | - |
| 宽度 | 4.5 mm | 4 mm | 4.4 mm | 6.1 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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