Freescale Semiconductor
Technical Data
Document Number: MC33886
Rev 9.0, 4/2011
5.0 A H-Bridge
The 33886 is a monolithic H-Bridge ideal for fractional horsepower
DC-motor and bi-directional thrust solenoid control. The IC
incorporates internal control logic, charge pump, gate drive, and low
R
DS(ON)
MOSFET output circuitry. The 33886 is able to control
continuous inductive DC load currents up to 5.0 A. Output loads can
be pulse width modulated (PWM-ed) at frequencies up to 10 kHz.
A Fault Status output reports under-voltage, short-circuit, and
over-temperature conditions. Two independent inputs control the two
half-bridge totem-pole outputs. Two disable inputs force the H-Bridge
outputs to tri-state (exhibit high-impedance).
The 33886 is parametrically specified over a temperature range of
-40
°C
≤
T
A
≤
125
°C,
5.0 V
≤
V+
≤
28 V. The IC can also be operated
up to 40 V with derating of the specifications. The IC is available in a
surface mount power package with exposed pad for heatsinking.
Features
• 5.0 V to 40 V Continuous Operation
• 120 mΩ R
DS(ON)
H-Bridge MOSFETs
• TTL / CMOS Compatible Inputs
• PWM Frequencies up to 10 kHz
• Active Current Limiting via Internal Constant OFF-Time PWM (with
Temperature-Dependent Threshold Reduction)
• Output Short-circuit Protection
• Under-voltage Shutdown
• Fault Status Reporting
33886
H-BRIDGE
VW SUFFIX (PB-FREE)
98ASH70702A
20-PIN HSOP
ORDERING INFORMATION
Device
MC33886PVW/R2
Temperature
Range (T
A
)
- 40 to 125 °C
Package
20 HSOP
5.0 V
CCP
33886
V+
OUT1
V+
MCU
IN
FS
Motor
IN1
IN2
D1
D2
OUT2
PGND
GND
OUT
OUT
OUT
OUT
Figure 1. 33886 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007 - 2011. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
CCP
VPWR
CCP
V+
Charge
Pump
(each)
80
uA
80
μA
5.0 V
Regulator
Current
Limit,
Current
Limit,
Overcurrent
Short-circuit
Sense
Sense Circuit
Circuit
OUT1
Gate Drive
OUT2
Over-
Over-
temperature
temperature
Under-voltage
Undervoltage
IN1
IN2
D1
D2
25
μA
25 uA
Control
Logic
FS
AGND
PGND
Figure 2. 33886 Simplified Internal Block Diagram
33886
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
AGND
FS
IN1
V+
V+
OUT1
OUT1
DNC
PGND
PGND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DNC
IN2
D1
CCP
V+
OUT2
OUT2
D2
PGND
PGND
Table 1. 33886 Pin Definitions
Figure 3. 33886 Pin Connections
A functional description of each pin can be found in the Functional Pin Description section beginning on
page 15.
Pin Number
1
2
Pin Name
AGND
FS
Formal Name
Analog Ground
Fault Status for H-
Bridge
Logic Input Control 1
Low-current analog signal ground.
Open drain active Low Fault Status output requiring a pull-up resistor to 5.0 V.
Definition
3
4, 5, 16
6, 7
8, 20
IN1
V
+
OUT1
DNC
True logic input control of OUT1 (i.e., IN1 logic High = OUT1 logic High).
Positive Power Supply Positive supply connections.
H-Bridge Output 1
Do Not Connect
Output 1 of H-Bridge.
Either do not connect (leave floating) or connect these pins to ground in the application.
They are test mode pins used in manufacturing only.
Device high-current power ground.
Active Low input used to simultaneously tri-state disable both H-Bridge outputs. When
D2 is logic Low, both outputs are tri-stated.
Output 2 of H-Bridge.
9 –12
13
PGND
D2
Power Ground
Disable 2
14, 15
17
18
OUT2
CCP
D1
H-Bridge Output 2
Charge Pump Capacitor External reservoir capacitor connection for internal charge pump capacitor.
Disable 1
Active High input used to simultaneously tri-state disable both H-Bridge outputs. When
D1 is logic High, both outputs are tri-stated.
True logic input control of OUT2 (i.e., IN2 logic High = OUT2 logic High).
19
IN2
Logic Input Control 2
33886
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Supply Voltage
Input Voltage
(1)
FS Status Output
(2)
Continuous Current
(3)
ESD Voltage for VW Package
Human Body Model
(4)
Machine Model
(5)
Storage Temperature
Ambient Operating Temperature
(6)
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow
(7)
,
(8)
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W)
(9)
Notes
1.
2.
3.
4.
5.
6.
7.
8.
V
ESD1
V
ESD2
T
STG
T
A
T
J
T
PPRT
R
θ
JB
±2000
±200
-65 to 150
-40 to 125
-40 to 150
Note 7.
~5.0
°C
°C
°C
°C
°C/W
Symbol
V+
V
IN
V
FS
I
OUT
Value
40
-0.1 to 7.0
7.0
5.0
Unit
V
V
V
A
V
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.
Continuous current capability so long as junction temperature is
≤
150
°
C.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
9.
33886
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 5.0 V
≤
V+
≤
28 V and -40°C
≤
T
A
≤
125
°C,
unless otherwise noted. Typical values noted
reflect the approximate parameter mean at T
A
= 25
°C
under nominal conditions, unless otherwise noted.
Characteristic
POWER SUPPLY
Operating Voltage Range
(10)
Standby Supply Current
V
EN
= 5.0 V, I
OUT
= 0 A
Threshold Supply Voltage
Switch-OFF
Switch-ON
Hysteresis
CHARGE PUMP
Charge Pump Voltage
V+ = 5.0 V
8.0 V
≤
V+
≤
40 V
CONTROL INPUTS
Input Voltage (IN1, IN2, D1, D2)
Threshold High
Threshold Low
Hysteresis
Input Current (IN1, IN2, D1)
(11)
V
IN
= 0 V
D2 Input Current
(12)
V
D2
= 5.0 V
I
D2
–
25
100
V
IH
V
IL
V
HYS
I
IN
-200
-80
–
μA
3.5
–
0.7
–
–
1.0
–
1.4
–
μA
V
V
CP
- V+
3.35
–
–
–
–
20
V
V+
(THRES-OFF)
V+
(THRES-ON)
V+
(HYS)
4.15
4.5
150
4.4
4.75
–
4.65
5.0
–
V
V
mV
V+
I
Q (standby)
–
–
20
5.0
–
40
V
mA
Symbol
Min
Typ
Max
Unit
Notes
10. Specifications are characterized over the range of 5.0 V
≤
V+
≤
28 V. Operation > 28 V will cause some parameters to exceed listed
min/max values. Refer to typical operating curves to extrapolate values for operation > 28 V but
≤
40 V.
11. Inputs IN1, IN2, and D1 have independent internal pull-up current sources.
12. The D2 input incorporates an active internal pull-down current sink.
33886
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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