3A, 60V, PNP, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
| 参数名称 | 属性值 |
| 厂商名称 | SEMELAB |
| 零件包装代码 | TO-276AB |
| 包装说明 | CHIP CARRIER, R-CBCC-N3 |
| 针数 | 3 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 外壳连接 | COLLECTOR |
| 最大集电极电流 (IC) | 3 A |
| 集电极-发射极最大电压 | 60 V |
| 配置 | SINGLE |
| 最小直流电流增益 (hFE) | 40 |
| JEDEC-95代码 | TO-276AB |
| JESD-30 代码 | R-CBCC-N3 |
| 元件数量 | 1 |
| 端子数量 | 3 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 极性/信道类型 | PNP |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 端子形式 | NO LEAD |
| 端子位置 | BOTTOM |
| 晶体管元件材料 | SILICON |
| 标称过渡频率 (fT) | 60 MHz |
| BUY91SMD-JQR-B | BUY91SMD-JQR | BUY91SMD-JQR-A | BUY91SMD-QR-B | |
|---|---|---|---|---|
| 描述 | 3A, 60V, PNP, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN | 3A, 60V, PNP, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN | 3A, 60V, PNP, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN | 3A, 60V, PNP, Si, POWER TRANSISTOR, TO-276AB, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN |
| 厂商名称 | SEMELAB | SEMELAB | SEMELAB | SEMELAB |
| 零件包装代码 | TO-276AB | TO-276AB | TO-276AB | TO-276AB |
| 包装说明 | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 | CHIP CARRIER, R-CBCC-N3 |
| 针数 | 3 | 3 | 3 | 3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 外壳连接 | COLLECTOR | COLLECTOR | COLLECTOR | COLLECTOR |
| 最大集电极电流 (IC) | 3 A | 3 A | 3 A | 3 A |
| 集电极-发射极最大电压 | 60 V | 60 V | 60 V | 60 V |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE |
| 最小直流电流增益 (hFE) | 40 | 40 | 40 | 40 |
| JEDEC-95代码 | TO-276AB | TO-276AB | TO-276AB | TO-276AB |
| JESD-30 代码 | R-CBCC-N3 | R-CBCC-N3 | R-CBCC-N3 | R-CBCC-N3 |
| 元件数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 3 | 3 | 3 | 3 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 极性/信道类型 | PNP | PNP | PNP | PNP |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON |
| 标称过渡频率 (fT) | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
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