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SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
www.ti.com
SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005
FEATURES
•
•
•
•
•
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
CC
Operation
Input and Open-Drain Output Accept
Voltages up to 5.5 V
Max t
pd
of 4.2 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
DBV PACKAGE
(TOP VIEW)
•
•
•
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DRL PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
NC
A
GND
1
5
V
CC
NC
A
1
2
3
5
V
CC
NC
A
1
2
3
5
V
CC
Y
2
GND
4
4
Y
GND
4
3
Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
YZV PACKAGE
(BOTTOM VIEW)
GND
A
DNU
3 4
2
1 5
Y
V
CC
GND
A
2 3
1 4
Y
V
CC
DNU − Do not use
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
.The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2005, Texas Instruments Incorporated
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZV (Pb-free)
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1)
(2)
Reel of 3000
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 4000
ORDERABLE
PART NUMBER
SN74LVC1G07YEAR
SN74LVC1G07YZAR
Reel of 3000
SN74LVC1G07YEPR
SN74LVC1G07YZPR
SN74LVC1G07YZVR
SN74LVC1G07DBVR
SN74LVC1G07DBVT
SN74LVC1G07DCKR
SN74LVC1G07DCKT
SN74LVC1G07DRLR
____
CV
C07_
CV_
CV_
_ _ _CV_
TOP-SIDE
MARKING
(2)
–40°C to 85°C
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
FUNCTION TABLE
INPUT
A
H
L
OUTPUT
Y
H
L
LOGIC DIAGRAM (POSITIVE LOGIC)
(DBV, DCK, DRL, YEA, YEP, YZA, and YZP Package)
A
2
4
Y
LOGIC DIAGRAM (POSITIVE LOGIC)
(YZV Package)
A
1
3
Y
2
www.ti.com
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
I
V
O
V
O
I
IK
I
OK
I
O
Supply voltage range
Input voltage range
(2)
Voltage range applied to any output in the high-impedance or power-off state
(2)
Voltage range applied to any output in the high or low
Input clamp current
Output clamp current
Continuous output current
Continuous current through V
CC
or GND
DBV package
DCK package
θ
JA
Package thermal impedance
(4)
DRL package
YEA/YZA package
YEP/YZP package
YZV package
T
stg
(1)
(2)
(3)
(4)
Storage temperature range
–65
state
(2) (3)
V
I
< 0
V
O
< 0
–0.5
–0.5
–0.5
–0.5
MAX
6.5
6.5
6.5
6.5
–50
–50
±50
±100
206
252
142
154
132
116
150
°C
°C/W
UNIT
V
V
V
V
mA
mA
mA
mA
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of V
CC
is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
3
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005
www.ti.com
Recommended Operating Conditions
(1)
MIN
V
CC
Supply voltage
Operating
Data retention only
V
CC
= 1.65 V to 1.95 V
V
IH
High-level input voltage
V
CC
= 2.3 V to 2.7 V
V
CC
= 3 V to 3.6 V
V
CC
= 4.5 V to 5.5 V
V
CC
= 1.65 V to 1.95 V
V
IL
Low-level input voltage
V
CC
= 2.3 V to 2.7 V
V
CC
= 3 V to 3.6 V
V
CC
= 4.5 V to 5.5 V
V
I
V
O
Input voltage
Output voltage
V
CC
= 1.65 V
V
CC
= 2.3 V
I
OL
Low-level output current
V
CC
= 3 V
V
CC
= 4.5 V
V
CC
= 1.8 V
±0.15
V, 2.5 V
±
0.2 V
∆t/∆v
T
A
(1)
Input transition rise or fall rate
Operating free-air temperature
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5 V
±
0.5 V
–40
0
0
1.65
1.5
0.65
×
V
CC
1.7
2
0.7
×
V
CC
0.35
×
V
CC
0.7
0.8
0.3
×
V
CC
5.5
5.5
4
8
16
24
32
20
10
5
85
°C
ns/V
mA
V
V
V
V
MAX
5.5
UNIT
V
All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs,
literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
I
OL
= 100
µA
I
OL
= 4 mA
V
OL
I
OL
= 8 mA
I
OL
= 16 mA
I
OL
= 24 mA
I
OL
= 32 mA
I
I
I
off
I
CC
∆I
CC
C
i
C
o
(1)
A input
V
I
= 5.5 V or GND
V
I
or V
O
= 5.5 V
V
I
= 5.5 V or GND,
One input at V
CC
– 0.6 V,
V
I
= V
CC
or GND
V
O
= V
CC
or GND
All typical values are at V
CC
= 3.3 V, T
A
= 25°C.
I
O
= 0
Other inputs at V
CC
or GND
TEST CONDITIONS
V
CC
1.65 V to 5.5 V
1.65 V
2.3 V
3V
4.5 V
0 to 5.5 V
0
1.65 V to 5.5 V
3 V to 5.5 V
3.3 V
3.3 V
4
5
MIN TYP
(1)
MAX
0.1
0.45
0.3
0.4
0.55
0.55
±5
±10
10
500
µA
µA
µA
µA
pF
pF
V
UNIT
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see
Figure 1)
PARAMETER
t
pd
FROM
(INPUT)
A
TO
(OUTPUT)
Y
V
CC
= 1.8 V
±
0.15 V
MIN
2.4
MAX
8.3
V
CC
= 2.5 V
±
0.2 V
MIN
1
MAX
5.5
V
CC
= 3.3 V
±
0.3 V
MIN
1.5
MAX
4.2
V
CC
= 5 V
±
0.5 V
MIN MAX
1
3.5
ns
UNIT
4
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