1 CHANNEL, AUDIO PREAMPLIFIER, DSO8
1 通道, 音频放大器, DSO8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, TQFN-8 |
| 针数 | 8 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 标称带宽 | 22 kHz |
| 商用集成电路类型 | AUDIO PREAMPLIFIER |
| JESD-30 代码 | S-XDSO-N8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.4 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| MAX4061ETA | MAX4060 | MAX4060ETA | MAX4060_11 | MAX4060EUA | MAX4061EUA | |
|---|---|---|---|---|---|---|
| 描述 | 1 CHANNEL, AUDIO PREAMPLIFIER, DSO8 | 1 CHANNEL, AUDIO PREAMPLIFIER, DSO8 | 1 CHANNEL, AUDIO PREAMPLIFIER, DSO8 | 1 CHANNEL, AUDIO PREAMPLIFIER, DSO8 | 1 CHANNEL, AUDIO PREAMPLIFIER, DSO8 | 1 CHANNEL, AUDIO PREAMPLIFIER, PDSO8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 表面贴装 | YES | Yes | YES | Yes | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO 铅 | NO LEAD | NO 铅 | GULL WING | GULL WING |
| 端子位置 | DUAL | 双 | DUAL | 双 | DUAL | DUAL |
| 是否无铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 零件包装代码 | QFN | - | QFN | - | SOIC | SOIC |
| 包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, TQFN-8 | - | 3 X 3 MM, 0.80 MM HEIGHT, TQFN-8 | - | MICRO MAX PACKAGE-8 | MICRO MAX PACKAGE-8 |
| 针数 | 8 | - | 8 | - | 8 | 8 |
| Reach Compliance Code | _compli | - | _compli | - | _compli | _compli |
| ECCN代码 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
| 标称带宽 | 22 kHz | - | 22 kHz | - | 22 kHz | 22 kHz |
| 商用集成电路类型 | AUDIO PREAMPLIFIER | - | AUDIO PREAMPLIFIER | - | AUDIO PREAMPLIFIER | AUDIO PREAMPLIFIER |
| JESD-30 代码 | S-XDSO-N8 | - | S-XDSO-N8 | - | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 |
| 长度 | 3 mm | - | 3 mm | - | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | - | 1 | - | 1 | 1 |
| 信道数量 | 1 | - | 1 | - | 1 | 1 |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSSON | - | HVSSON | - | TSSOP | TSSOP |
| 封装形状 | SQUARE | - | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | - | 240 | - | 240 | 240 |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | - | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.4 V | - | 4.5 V | - | 4.5 V | 2.4 V |
| 技术 | BICMOS | - | BICMOS | - | BICMOS | BICMOS |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子节距 | 0.65 mm | - | 0.65 mm | - | 0.65 mm | 0.65 mm |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | - | 20 | 20 |
| 宽度 | 3 mm | - | 3 mm | - | 3 mm | 3 mm |
| Base Number Matches | 1 | - | 1 | - | 1 | 1 |
| 增益 | - | 20 dB | 20 dB | 20 dB | 20 dB | - |
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