* 250 piece packs supplied in sealed bags of cut tape length
1773270 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
SMD High Power Precision Resistors
Type RN73 Series
Paper Tape Specification
Type
RN73 1J (0603)
A
1.10 ±0.05
B
1.16 ±0.05
1.90 ±0.05
2.37 ±0.05
3.55 ±0.05
3.40 ±0.05
W
8.00 ±0.10
8.00 ±0.10
8.00 ±0.10
8.00 ±0.10
8.00 ±0.10
E
1.75 ±0.05
1.75 ±0.05
1.75 ±0.05
1.75 ±0.05
1.75 ±0.05
F
3.5 ±0.05
3.5 ±0.05
3.5 ±0.05
3.5 ±0.05
3.5 ±0.05
P
0
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.05
P
1
2.00 ±0.05
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
P
2
øD
0
T
0.40 ±0.03
0.60 ±0.03
0.75 ±0.05
0.75 ±0.05
0.75 ±0.05
RN73 1E (0402)
0.70 ±0.05
RN73 2A (0805)
1.60 ±0.05
RN73 2B (1206)
2.00 ±0.05
RN73 2E (1210)
2.75 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.60 ±0.10
Embossed Plastic Tape Specifications
Type
RN73 2H (2010)
RN73 3A (2512)
A
2.85 ±0.10
3.40 ±0.10
B
5.45 ±0.10
6.65 ±0.10
W
12.0 ±0.10
12.0 ±0.10
E
1.75 ±0.10
1.75 ±0.10
F
5.5 ±0.05
5.5 ±0.05
P
0
4.00 ±0.05
4.00 ±0.05
P
1
4.00 ±0.10
4.00 ±0.10
P
2
øD
0
T
2.00 ±0.05 1.50 +0.10 1.00 ±0.20
2.00 ±0.05 1.50 +0.10 1.00 ±0.20
How to Order
RN73
Common Part
C
Temp. Coefficient
2A
Package Size
1E - 0402
* 1J - 0603
* 2A - 0805
RN73 - High
precision resistors
(RoHS compliant)
A - ±5ppm/°C
* C - ±10ppm/°C
2B - 1206
2E - 1210
2H - 2010
3A - 2512
* Preferred stock item
* Preferred stock item
100R
(100 ohms)
1K0
(1000 ohms)
100K
(100,000 ohms)
* Preferred stock item
A - ±0.05%
*B - ±0.1%
L - ±0.01%
100K
Resistor Value
B
Tolerance
TDF
Packaging
TG - 250 Cut tape
length (1E, 1J, 2A, 2B)
TDF -1000 REEL
(1E, 1J, 2A, 2B)
TD - 5000 REEL
(1E, 1J, 2A, 2B, 2E)
TDG - 250 REEL
(1E, 1J, 2A only)
TE - 4000 REEL
(2H, 3A only)
TE Connectivity, TE connectivity (logo) and TE (logo) are trademarks.
Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
While TE has made every reasonable effort to ensure the accuracy of the information in this datasheet, TE does not guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein
at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantabili-
ty or fitness for a particular purpose. The dimensions in this datasheet are for reference purposes only and are subject to change without notice. Specifications are subject to change
without notice. Consult TE for the latest dimensions and design specifications.
空分复用 (SDM) MIMO 处理可显著提高频谱效率，进而大幅增加无线通信系统的容量。空分复用 MIMO 通信系统作为一种能够大幅提升无线系统容量和连接可靠性的手段，近来吸引了人们的广泛关注。 MIMO 无线系统最佳硬判决检测方式是最大似然 (ML) 检测器。ML 检测因为比特误码率 (BER)性能出众，非常受欢迎。不过，直接实施的复杂性会随着天线和调制方案的增加呈指数级增强，使...[详细]
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