8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.05 mm |
| 湿度敏感等级 | NOT APPLICABLE |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 60 dB |
| 通态电阻匹配规范 | 36 Ω |
| 最大通态电阻 (Ron) | 400 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT APPLICABLE |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 2100 ns |
| 最长接通时间 | 1300 ns |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 宽度 | 7.62 mm |

| MUX08BQ/883C | 5962-87716022A | 5962-8771602EA | MUX08AQ/883C | MUX08NBC | |
|---|---|---|---|---|---|
| 描述 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16 | Single-Ended Multiplexer, 1 Func, 8 Channel, BIPolar, CQCC20, CERAMIC, LCC-20 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, UUC16, 0.093 X 0.059 INCH, DIE-16 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 零件包装代码 | DIP | QLCC | DIP | DIP | DIE |
| 包装说明 | CERDIP-16 | QCCN, | CERDIP-16 | CERDIP-16 | DIE, |
| 针数 | 16 | 20 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | R-GDIP-T16 | R-XUUC-N16 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 20 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 400 Ω | 400 Ω | 400 Ω | 300 Ω | 300 Ω |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| 封装代码 | DIP | QCCN | DIP | DIP | DIE |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | UNCASED CHIP |
| 峰值回流温度(摄氏度) | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | UPPER |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | - | Rochester Electronics |
| JESD-609代码 | e0 | - | e0 | e0 | - |
| 长度 | 19.05 mm | 8.89 mm | 19.05 mm | 19.05 mm | - |
| 湿度敏感等级 | NOT APPLICABLE | - | NOT APPLICABLE | NOT APPLICABLE | NOT SPECIFIED |
| 标称断态隔离度 | 60 dB | 60 dB | 60 dB | 60 dB | - |
| 通态电阻匹配规范 | 36 Ω | 80 Ω | 80 Ω | 21 Ω | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
| 座面最大高度 | 5.08 mm | 2.54 mm | 5.08 mm | 5.08 mm | - |
| 最长断开时间 | 2100 ns | 400 ns | 400 ns | 2100 ns | - |
| 最长接通时间 | 1300 ns | 2000 ns | 2000 ns | 1300 ns | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | NOT SPECIFIED |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 宽度 | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm | - |
| Base Number Matches | - | 1 | 1 | 1 | - |
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