2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs
SY88923 | SY88923KCTR | SY88923KGTR | SY88923KC | SY88923KG | SY88923_11 | |
---|---|---|---|---|---|---|
描述 | 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs | 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs | 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs | 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs | 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs | 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
是否Rohs认证 | - | 不符合 | 符合 | 不符合 | 符合 | - |
厂商名称 | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - |
包装说明 | - | TSSOP, TSSOP10,.19,20 | TSSOP, | TSSOP, TSSOP10,.19,20 | TSSOP, | - |
Reach Compliance Code | - | _compli | compli | _compli | compli | - |
JESD-30 代码 | - | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | - |
JESD-609代码 | - | e0 | e4 | e0 | e4 | - |
长度 | - | 3 mm | 3 mm | 3 mm | 3 mm | - |
湿度敏感等级 | - | 1 | 1 | 1 | 1 | - |
功能数量 | - | 1 | 1 | 1 | 1 | - |
端子数量 | - | 10 | 10 | 10 | 10 | - |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | - | TSSOP | TSSOP | TSSOP | TSSOP | - |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | - |
封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
峰值回流温度(摄氏度) | - | 240 | 260 | 240 | 260 | - |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | - |
标称供电电压 | - | 5 V | 5 V | 5 V | 5 V | - |
表面贴装 | - | YES | YES | YES | YES | - |
电信集成电路类型 | - | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | - |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
端子面层 | - | Tin/Lead (Sn85Pb15) | NICKEL PALLADIUM GOLD | Tin/Lead (Sn85Pb15) | NICKEL PALLADIUM GOLD | - |
端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | - |
端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
端子位置 | - | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | - | 30 | 40 | 30 | 40 | - |
宽度 | - | 3 mm | 3 mm | 3 mm | 3 mm | - |
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