2.0-9.0 GHz
GaAs MMIC Amplifier
February 2008 - Rev 03-Feb-08
CMM-9-BD
Chip Diagram
Features
Wide Bandwidth
13 dB Typical Gain
Small Size: 39x35 mils
Directly Cascadable
Self-Biased
Single Power Supply
General Description
Mimix Broadband's CMM-9 is a 2 to 9 GHz GaAs MMIC
amplifier. It is a two-stage feedback design which provides
high gain and good power from a single power supply.
Applications include oscillator buffers, RF and IF gain blocks
and driver amplifiers.
The CMM-9 is a very small chip which provides 13 dB of gain
and 17 dBm of power from a 6 volt supply. The chip is
directly cascadable with no additional components. The
circuit’s self-biasing feature provides excellent performance
from a 5 to 7 volt supply. Care must be taken to isolate the
input from the external DC voltages.
Mimix MMICs are fabricated on ion-implanted GaAs material
with gold-based metalization. The FET gates are sub-half
micron, tee cross-section construction. Air bridges are used
for top level interconnection. Silicon nitride serves as
capacitor dielectric and surface passivation. Mesa resistors
are used for feedback and bias function.
The CMM-9 is available in chip form. It can be screened to
meet commercial, military Hi-Rel or space grade reliability
requirements. Custom wafer qualification for special
electrical and/or reliability requirements is also available.
Absolute Maximum Ratings
Voltage
Continuous Power Dissipation
Channel Temperature
Storage Temperature
Mounting Temperature
Input Power
JC
8V
1.25 W
+175 ºC
-65 to +175
º
C
+320 ºC
+20 dBm
80 ºC/W
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 5
Characteristic Data and Specifications are subject to change without notice.
©2008
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-9.0 GHz
GaAs MMIC Amplifier
February 2008 - Rev 03-Feb-08
CMM-9-BD
Specifications (T
A
= 25ºC,V
DD
= 6V, 2-9 GHz)
Bonding Diagram
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 5
Characteristic Data and Specifications are subject to change without notice.
©2008
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-9.0 GHz
GaAs MMIC Amplifier
February 2008 - Rev 03-Feb-08
CMM-9-BD
Typical Performance (T
A
= 25ºC)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice.
©2008
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-9.0 GHz
GaAs MMIC Amplifier
February 2008 - Rev 03-Feb-08
CMM-9-BD
Typical Scattering Parameters,T
A
= 25ºC
(S-Parameters Include Bonding Wire Parasitics)
Equivalent Circuit
Wafer Qualification Procedure
100% DC Text
100% Visual Insp.
Sample Mechanical
Evaluation
Sample Circuit
Performance Tests*
Reliability
Assessment
*80% of tested samples must meet specifications
for wafer acceptance.
NF, Gain, P1dB,
VSWR
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 5
Characteristic Data and Specifications are subject to change without notice.
©2008
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-9.0 GHz
GaAs MMIC Amplifier
February 2008 - Rev 03-Feb-08
CMM-9-BD
Handling and Assembly Information
CAUTION!
- Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy
- Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD
- Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attach:
Conductive epoxy or preform die attach is recom-
mended. For preform die attach: Preform: AuSn (80% Au, 20%
Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool: Tweezers;
Time: 1 min or less.
Wire Bonding:
Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding: Stage
Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
RoHS Compliant Parts
- All Mimix products are RoHS compliant unless otherwise specified.
Ordering Information
Part Number for Ordering
CMM-9-BD-000X
Description
Where “X” is RoHS compliant die packed in “V” - vacuum release gel packs or
W” - waffle trays
Caution: ESD Sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Proper ESD procedures should be followed when handling this device.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 5
Characteristic Data and Specifications are subject to change without notice.
©2008
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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