Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Vishay(威世) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 550 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-15 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| DG508ACK-4 | DG508ACJ-4 | DG508AP/883 | DG508ACY | |
|---|---|---|---|---|
| 描述 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 550 Ω | 550 Ω | 500 Ω | 550 Ω |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | SOP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | YES |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
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