Differential Multiplexer, 1 Func, 8 Channel, CMOS, CDIP28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Harris |
包装说明 | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-GDIP-T28 |
JESD-609代码 | e0 |
标称负供电电压 (Vsup) | -15 V |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 28 |
最大通态电阻 (Ron) | 100 Ω |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 12/+-15 V |
认证状态 | Not Qualified |
最大信号电流 | 0.03 A |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
最长断开时间 | 300 ns |
最长接通时间 | 300 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
DG407AK/883 | 5962-9562301QXA | 5962-9562302QXA | DG406AK/883 | |
---|---|---|---|---|
描述 | Differential Multiplexer, 1 Func, 8 Channel, CMOS, CDIP28 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28 | Differential Multiplexer, 1 Func, 8 Channel, CMOS, CDIP28 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28, |
厂商名称 | Harris | Harris | Harris | Harris |
Reach Compliance Code | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
信道数量 | 8 | 16 | 8 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 |
最大通态电阻 (Ron) | 100 Ω | 300 Ω | 300 Ω | 100 Ω |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | NO |
最长断开时间 | 300 ns | 300 ns | 300 ns | 300 ns |
最长接通时间 | 300 ns | 300 ns | 300 ns | 300 ns |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL |
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