For high temperature operation (>60ºC), a LED current of 4mA is recommended.
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
30
25
Device Count (N)
Device Count (N)
Device Count (N)
15
15
20
15
10
5
0
1.235 1.240 1.245 1.250 1.255 1.260 1.265
LED Forward Voltage (V)
0
0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728
PLB190
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
20
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA)
20
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA)
10
10
5
5
0
0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412
Turn-On Time (ms)
Turn-Off Time (ms)
20
Typical LED Current to Operate
(N=50, I
L
=100mA)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=0mA, I
L
=100mA)
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, I
F
=2mA)
Device Count (N)
Device Count (N)
15
10
5
0
0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50
LED Current (mA)
13.0
13.3
13.5 13.8 14.0 14.3
On-Resistance ( )
14.5
Device Count (N)
460 465
470 475 480 485 490
Blocking Voltage (V
P
)
495
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
-40
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
Temperature (ºC)
80
100
735
730
725
720
715
710
0
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA)
6000
5000
Turn-Off Time ( s)
4000
3000
2000
1000
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA)
Turn-On Time ( s)
10
20
30
40
LED Forward Current (mA)
50
0
10
20
30
40
LED Forward Current (mA)
50
0.65
0.60
LED Current (mA)
LED Current to Operate
vs. Temperature
(I
L
=75mA)
900
800
Turn-On Time ( s)
Typical Turn-On Time
vs. Temperature
(I
L
=75mA)
Turn-Off Time ( s)
5000
4500
4000
3500
3000
2500
2000
1500
100
1000
-40
-20
Typical Turn-Off Time
vs. Temperature
(I
L
=75mA)
0.55
0.50
0.45
0.40
0.35
-40
700
600
500
400
300
-40
I
F
=2mA
-20
0
20
40
60
Temperature (ºC)
80
I
F
=5mA
I
F
=2mA
I
F
=5mA
-20
0
20
40
60
Temperature (ºC)
80
100
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
On-Resistance vs. Temperature
AC/DC Configuration
(I
F
=0mA, I
L
=75mA)
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=0mA)
PLB190
20
19
On Resistance ( )
0.15
0.10
Load Current (A)
0.05
0.00
-0.05
-0.10
0.14
0.13
Load Current (A)
0.12
0.11
0.10
0.09
0.08
Maximum Load Current
vs. Temperature - AC/DC Configuration
(I
F
=0mA)
18
17
16
15
14
13
12
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-0.15
-2.0 -1.5 -1.0
-0.5 0.0 0.5 1.0
Load Voltage (V)
1.5
2.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
7.0
6.5
On-Resistance ( )
On-Resistance vs. Temperature
DC-Only Configuration
(I
F
=0mA, I
L
=100mA)
Load Current (mA)
0.25
0.20
0.15
0.10
0.05
0.00
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=0mA)
0.26
0.24
Load Current (A)
0.22
0.20
0.18
0.16
0.14
0.12
Maximum Load Current
vs. Temperature - DC Configuration
(I
F
=0mA)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.0
0.2
0.4
0.6
0.8
Load Voltage (V)
1.0
1.2
0.10
-40
-20
0
20
40
60
Temperature (ºC)
80
100
480
475
Blocking Voltage (V
P
)
470
465
460
455
450
445
440
-40
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
350
300
Leakage (nA)
250
200
150
100
50
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(I
F
=5mA, V
L
=400V)
Output Capacitance (pF)
140
120
100
80
60
40
20
0
0
Output Capacitance
vs. Load Voltage
(I
F
=5mA, f=1MHz)
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
50
100
150
Load Voltage (V)
200
Energy Rating Curve
1.0
0.8
0.6
0.4
0.2
0.0
10 s 100 s 1ms 10ms 100ms
Time
Load Current (A)
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
PLB190
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLB190 / PLB190S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLB190 / PLB190S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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