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MASW-004103-1365_V4

产品描述HMICTM Silicon PIN Diode SP4T Switch
文件大小343KB,共9页
制造商MACOM
官网地址http://www.macom.com
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MASW-004103-1365_V4概述

HMICTM Silicon PIN Diode SP4T Switch

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MASW-004103-1365
HMIC
TM
Silicon PIN Diode SP4T Switch
50 MHz - 20 GHz
Features
Specified from 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount™ Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm C.W. Power Handling
1
@ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Rev. V4
Functional Schematic
Description
The MASW-004103-1365 is a Surmount™
broadband monolithic SP4T switch using series and
shunt connected silicon PIN diodes. This part is
designed for use as a moderate signal, high
performance switch in applications up to 20 GHz.
This Surface Mount
chipscale configuration is
optimized for broadband performance with minimal
associated parasitics usually associated with hybrid
MIC designs incorporating beam lead and PIN
diodes that require chip and wire assembly.
The MASW-004103-1365 is fabricated using M/A-
COM Technology Solutions patented HMIC™
(Heterolithic Microwave Integrated Circuit) process,
US Patent 5,268,310. This process allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in low
loss, low dispersion glass. By using small spacing
between elements, this combination of silicon and
glass gives HMIC devices low loss and high isolation
performance through low millimeter frequencies.
Selective backside metalization is applied producing
a Surface Mount device. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection.
These protective coatings prevent
damage to the junction and the anode airbridge
during handling and assembly.
1.
1
Power Handling Testing performed @ 2GHz
J3
J4
J2
J1
Pin Configuration
2
Pin
J1
J2
Function
RFC
RF1
2
J5
Ordering Information
J3
J4
J5
2.
RF2
RF3
RF4
The exposed pad centered on the chip bottom must be
connected to RF and DC ground.
Ordering Information
Part Number
MASW-004103-13650G
MASW-004103-13655P
MASW-004103-13650P
MASW-004103-001SMB
Package
50 piece gel pack
500 piece reel
3000 piece reel
Sample Test Board
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
India
Tel: +91.80.43537383
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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