Philips Semiconductors
Product specification
Damper diode
fast, high-voltage
FEATURES
• Low forward volt drop
• Fast switching
• Soft recovery characteristic
• High thermal cycling performance
• Isolated mounting tab
BY329X-1700S
SYMBOL
QUICK REFERENCE DATA
V
R
= 1700 V
V
F
≤
1.5 V
I
F(PEAK)
= 6 A
I
FSM
≤
60 A
t
rr
≤
170 ns
k
1
a
2
GENERAL DESCRIPTION
Glass-passivated double diffused
rectifier diode featuring low forward
voltage drop, fast reverse recovery
and soft recovery characteristic.
The device is intended for use in TV
receivers and PC monitors.
The BY329X series is supplied in
the conventional leaded SOD113
package.
PINNING
PIN
1
2
tab
DESCRIPTION
cathode
anode
isolated
SOD113
case
1
2
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
V
RSM
V
RRM
V
RWM
I
F(peak)
I
FRM
I
F(RMS)
I
FSM
T
stg
T
j
PARAMETER
Peak non repetitive reverse
voltage
Peak repetitive reverse voltage
Crest working reverse voltage
Peak working forward current
Peak repetitive forward current
RMS forward current
Peak non-repetitive forward
current
Storage temperature
Operating junction temperature
CONDITIONS
MIN.
-
-
-
-
-
-
-
-
-40
-
MAX.
1700
1700
1300
6
6
14
10
60
150
150
UNIT
V
V
V
A
A
A
A
A
˚C
˚C
f = 16 kHz
f = 64 kHz
t = 25
µs; δ
= 0.5; T
hs
≤
91 ˚C
t = 10 ms
sinusoidal; T
j
= 150 ˚C prior to
surge; with reapplied V
RWM(max)
ISOLATION LIMITING VALUE & CHARACTERISTIC
T
hs
= 25 ˚C unless otherwise specified
SYMBOL
V
isol
PARAMETER
R.M.S. isolation voltage from
both terminals to external
heatsink
CONDITIONS
f = 50-60 Hz; sinusoidal
waveform;
R.H.
≤
65% ; clean and dustfree
MIN.
-
TYP.
MAX.
2500
UNIT
V
C
isol
Capacitance from both terminals f = 1 MHz
to external heatsink
-
10
-
pF
September 1998
1
Rev 1.200
Philips Semiconductors
Product specification
Damper diode
fast, high-voltage
THERMAL RESISTANCES
SYMBOL
R
th j-hs
R
th j-a
PARAMETER
Thermal resistance junction to
heatsink
Thermal resistance junction to
ambient
CONDITIONS
with heatsink compound
without heatsink compound
in free air.
MIN.
-
-
-
BY329X-1700S
TYP.
-
-
55
MAX.
4.8
5.9
-
UNIT
K/W
K/W
K/W
STATIC CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL
V
F
I
R
PARAMETER
Forward voltage
Reverse current
CONDITIONS
I
F
= 6.5 A
I
F
= 6.5 A; T
j
= 125 ˚C
V
R
= V
RWMmax
V
R
= V
RWMmax
; T
j
= 125 ˚C
MIN.
-
-
-
-
TYP.
1.35
1.2
-
-
MAX.
1.65
1.5
250
1.0
UNIT
V
V
µA
mA
DYNAMIC CHARACTERISTICS
T
j
= 25 ˚C unless otherwise stated
SYMBOL
V
fr
t
fr
t
rr
Q
s
PARAMETER
Forward recovery voltage
Forward recovery time
Reverse recovery time
Reverse recovery charge
CONDITIONS
I
F
= 6.5 ; dI
F
/dt = 50 A/µs
I
F
= 6.5 A; dI
F
/dt = 50 A/µs; V
F
= 5 V
I
F
= 1 A; -dI
F
/dt = 50 A/µs; V
R
≥
30 V
I
F
= 2 A; -dI
F
/dt = 20 A/µs; V
R
≥
30 V
MIN.
-
-
-
-
TYP.
30
300
130
0.7
MAX.
40
320
170
1.0
UNIT
V
ns
ns
µC
I
F
I
dI
F
dt
F
trr
10%
tfr
VF
Qs
time
time
V
VF
5V
time
25%
100%
fr
I
R
Fig.1. Definition of Vfr and tfr
Fig.2. Definition of t
rr
and Q
s
September 1998
2
Rev 1.200
Philips Semiconductors
Product specification
Damper diode
fast, high-voltage
BY329X-1700S
VCC
30
IF / A
Tj = 125 C
Tj = 25 C
BY329S17
Line output transformer
LY
20
10
Cf
deflection transistor
D1
Cs
0
typ
max
0
0.5
1
1.5
VF / V
2
Fig.3. Basic horizontal deflection circuit.
Fig.5. BY329-1500S Typical and maximum forward
characteristic I
F
= f(V
F
); parameter T
j
Transient thermal impedance, Zth j-hs (K/W)
100
Maximum pulse width / us
V
BY459X-1500
VRRM
10
1
pulse
width tp
time
period T
10
0.1
0.01
P
D
t
p
D=
t
p
T
t
1
10
line frequency / kHz
100
0.001
1us
T
10us
100us 1ms
10ms 100ms
1s
pulse width, tp (s)
BY229F
10s
Fig.4. Maximum allowable pulse width t
p
versus line
frequency; Basic horizontal deflection circuit.
Fig.6. Transient thermal impedance Z
th
= f(t
p
)
September 1998
3
Rev 1.200
Philips Semiconductors
Product specification
Damper diode
fast, high-voltage
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
3.2
3.0
10.3
max
BY329X-1700S
4.6
max
2.9 max
Recesses (2x)
2.5
0.8 max. depth
2.8
6.4
15.8
19
max. max.
seating
plane
15.8
max
3 max.
not tinned
3
2.5
13.5
min.
1
0.4
M
2
1.0 (2x)
0.6
2.54
5.08
0.5
2.5
0.9
0.7
Fig.7. SOD113; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
September 1998
4
Rev 1.200
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