MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Features
•
•
•
•
Noise Figure: 1.8 dB Typical
Gain: 17 dB Typical
Single Bias Supply
DC Decoupled RF Input and Output
Rev. V7
Die
Description
The MAAM37000 die is a wide-band, low noise,
MMIC amplifier. It includes two integrated gain
stages and employs series inductive feedback to
obtain excellent noise figure and a good 50
Ω,
input
and output impedance match over the entire
frequency band. The MAAM37000 operates from a
single +4 V supply.
The MAAM37000 performs well as a low noise
amplifier in receive applications and as a driver or
buffer amplifier where high gain, excellent linearity
and low power consumption are important. Because
of its wide bandwidth, the MAAM37000 can be used
in numerous commercial and government system
applications, such as TVRO, VSAT, missile
guidance, and radar.
The MAAM37000 is
manufactured in-house using a reliable, 0.5-micron,
GaAs MESFET process. This product is 100% RF
tested to ensure compliance to performance
specifications.
Schematic
Ordering Information
Part Number
MAAM37000
Package
DIE
Absolute Maximum Ratings
1
Parameter
Voltage
Input Power
Operating Temperature
Storage Temperature
Absolute Maximum
+7 V
+20 dBm
-55°C to +125°C
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Parameter
Gain
2
Gain Flatness
Noise Figure
2
Input VSWR
Output VSWR
Output Power at 1 dB Gain Compression
Third Order Intercept
Reverse Isolation
Rth
2. 100% on-wafer tested.
Rev. V7
Electrical Specifications: T
A
= 25°C, Z
0
= 50
Ω,
V
DD
= +4 VDC, I
DD
= 75 mA Typ, 100 mA
Units
dB
dB
dB
Ratio
Ratio
dBm
dBm
dB
°C/W
—
—
—
—
—
—
—
Min
15.0
Typ.
17.0
± 0.8
1.8
1.5:1
1.5:1
14
24
35
85
2.8
—
—
—
—
—
—
Max
—
Typical Performance Curves
Gain
20
Noise Figure
6
5
4
+25 C
-55 C
+85 C
18
16
3
14
2
+25 C
-55 C
+85 C
12
1
0
10
2
3
4
5
6
7
8
2
3
4
5
6
7
8
Frequency (GHz)
Frequency (GHz)
VSWR
6
5
4
3
2
1
0
INPUT
OUTPUT
2
3
4
5
6
7
8
2
Frequency (GHz)
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Typical Bias Configuration
3,4,5
Outline Drawing
Rev. V7
3. Nominal bias is obtained with on-chip resistors by grounding
pads S1b and S2b.
4. Ground pads S1b and S2c for lower second state current.
5. Optional biasing can be obtained with off-chip resistors bonded
from pads S1a and S2a to ground. Adjusting the bias can
customize the performance to suit special requirements.
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MAAM37000
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Handling Procedures
Permanent damage to the MAAM37000 may occur
if the following precautions are not adhered to:
A. Cleanliness - The MAAM37000 should be han-
dled in a clean environment. DO NOT attempt
to clean assembly after the MAAM37000 is
installed.
B. Static Sensitivity - All die handling equipment
and personnel should comply with DOD-STD-
1686 Class I.
C. Transients - Avoid instrument and power sup-
ply transients while bias is connected to the
MAAM37000. Use shielded signal and bias
cables to minimize inductive pick-up.
D. General Handling - DO NOT touch the surface
of the die.
It is recommended that the
MAAM37000 die be handled along the long
side with a sharp pair of tweezers.
Rev. V7
Bonding
A. Ball or wedge bond with 1.0 mil diameter gold
wire of 3.0 mil x 0.5 mil ribbon. Thermosonic
bonding with a nominal stage temperature of
150°C and a ball bonding force of 40 to 50
grams or wedge bonding force of 18 to 22
grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels
necessary to achieve reliable bonds.
B. Bonds should be started on the die and termi-
nated on the package.
C. Bonding pads are 4.0 x 4.0 mils minimum.
Mounting
The MAAM37000 is back-metallized with Pd/Ni/Au
(100/1, 000/30,000Å) metallization. It can be die-
mounted using Au/Sn eutectic preforms or a ther-
mally and electrically conductive epoxy. The at-
tachment surface should be clean and flat.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
hot 95/5 nitrogen/hydrogen gas is applied, sol-
der temperature should be approximately 290°
C.
B. DO NOT expose the MAAM37000 to a tem-
perature greater than 320°C for more than 20
seconds. No more than 3 seconds of scrub-
bing should be required for attachment.
Epoxy Die Attach:
A. Electrically conductive epoxy is required.
B. Apply a minimum amount of epoxy and place
the MAAM37000 into position. A thin epoxy
fillet should be visible around the perimeter of
the die.
C.
Cure epoxy per manufacturer’s recommended
schedule.
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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