DRIVER
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | SOP, SOP20,.4 |
| Reach Compliance Code | not_compliant |
| 系列 | ACT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 10.4 ns |
| 传播延迟（tpd） | 12.5 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| CD74ACT373M | 5962-01-386-0435 | CD74AC373M | CD74ACT373E | CD74ACT373M96 | CD54AC533F3A | |
|---|---|---|---|---|---|---|
| 描述 | DRIVER | IC,LATCH,SINGLE,8-BIT,AC-CMOS,SOP,20PIN,PLASTIC | DRIVER | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20 | DRIVER | CD54AC533F3A |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-XDIP-T20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | D LATCH | BUS DRIVER | BUS DRIVER | BUS DRIVER | D LATCH |
| 最大I（ol） | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.024 A | 0.024 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | SOP | SOP | SOP | DIP | SOP | DIP |
| 封装等效代码 | SOP20,.4 | SOP20,.4 | SOP20,.4 | DIP20,.3 | SOP20,.4 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 5 V | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 10.4 ns | 11.9 ns | 11.9 ns | 10.4 ns | 10.4 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | AUTOMOTIVE | AUTOMOTIVE | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | SOP, SOP20,.4 | SOP, SOP20,.4 | - | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 |
| 最小供电电压 (Vsup) | 4.5 V | 1.5 V | 1.5 V | - | 4.5 V | 1.5 V |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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