Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | RCA |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 计数方向 | UP |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 负载/预设输入 | NO |
| 逻辑集成电路类型 | BINARY COUNTER |
| 工作模式 | ASYNCHRONOUS |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| CD4024AFX | CD4024AF/3 | CD4024AK/3 | CD4024AD/3 | CD4024AEX | |
|---|---|---|---|---|---|
| 描述 | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14 | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14 | Binary Counter, Asynchronous, Up Direction, CMOS, CDFP14 | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14 | Binary Counter, Asynchronous, Up Direction, CMOS, PDIP14 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | RCA | RCA | RCA | RCA | RCA |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | UP | UP | - | UP | UP |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | - | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 |
| 负载/预设输入 | NO | NO | - | NO | NO |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | - | BINARY COUNTER | BINARY COUNTER |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 功能数量 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 14 | 14 | - | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | - | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | - | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | - | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE |
| 表面贴装 | NO | NO | - | NO | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | - | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL |
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