IC,LOGIC GATE,QUAD 2-INPUT NAND,HCT-CMOS,SOP,14PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
包装说明 | SOP, SOP14,.25 |
Reach Compliance Code | not_compliant |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | NAND GATE |
最大I(ol) | 0.00002 A |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | OPEN-DRAIN |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP14,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TAPE AND REEL |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 30 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
CD74HCT03M96 | CD74HC03E | CD74HCT03M | CD74HC03M96 | CD74HC03M | CD74HCT03E | |
---|---|---|---|---|---|---|
描述 | IC,LOGIC GATE,QUAD 2-INPUT NAND,HCT-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC | HCT SERIES, QUAD 2-INPUT NAND GATE, PDSO14 | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HCT-CMOS,DIP,14PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 代码 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
最大I(ol) | 0.00002 A | 0.004 A | 0.00002 A | 0.004 A | 0.004 A | 0.004 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | SOP | SOP | SOP | DIP |
封装等效代码 | SOP14,.25 | DIP14,.3 | SOP14,.25 | SOP14,.25 | SOP14,.25 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V |
Prop。Delay @ Nom-Sup | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 36 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO | NO |
表面贴装 | YES | NO | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved