SIPO Based Peripheral Driver, 8 Driver, 0.5A, BICMOS, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.4 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | SPLIT SUPPLY OPERATION POSSIBLE |
| 驱动器位数 | 8 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.304 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-COLLECTOR |
| 输出电流流向 | SINK |
| 最大输出电流 | 0.35 A |
| 标称输出峰值电流 | 0.5 A |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MIC5822AJ | 5962-8764101EA | MIC5821CN | MIC5822AJBQ | |
|---|---|---|---|---|
| 描述 | SIPO Based Peripheral Driver, 8 Driver, 0.5A, BICMOS, CDIP16, CERAMIC, DIP-16 | SIPO Based Peripheral Driver, 0.5A, BICMOS, CDIP16, CERAMIC, DIP-16 | SIPO BASED PRPHL DRVR, PDIP16 | SIPO Based Peripheral Driver, 0.5A, BICMOS, CDIP16, CERAMIC, DIP-16 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | DIP, DIP16,.4 | DIP, | DIP, | DIP, |
| Reach Compliance Code | compliant | unknown | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 接口集成电路类型 | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER | SIPO BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-GDIP-T16 | R-CDIP-T16 | R-PDIP-T16 | R-GDIP-T16 |
| 长度 | 19.304 mm | 19.304 mm | 19.304 mm | 19.304 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C |
| 输出电流流向 | SINK | SINK | SINK | SINK |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 3.937 mm | 5.08 mm |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 零件包装代码 | DIP | DIP | - | DIP |
| 针数 | 16 | 16 | - | 16 |
| 其他特性 | SPLIT SUPPLY OPERATION POSSIBLE | - | SPLIT SUPPLY OPERATION POSSIBLE | SPLIT SUPPLY OPERATION POSSIBLE |
| 输入特性 | STANDARD | - | STANDARD | STANDARD |
| JESD-609代码 | e0 | e0 | e0 | - |
| 输出特性 | OPEN-COLLECTOR | - | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 标称输出峰值电流 | 0.5 A | 0.5 A | - | 0.5 A |
| 输出极性 | INVERTED | - | INVERTED | INVERTED |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | - |
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