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MA4P7464F-1072T_1

产品描述SILICON, PIN DIODE
产品类别半导体    分立半导体   
文件大小105KB,共7页
制造商MACOM
官网地址http://www.macom.com
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MA4P7464F-1072T_1概述

SILICON, PIN DIODE

硅, PIN二极管

MA4P7464F-1072T_1规格参数

参数名称属性值
端子数量2
元件数量1
加工封装描述ROHS COMPLIANT, 陶瓷, CASE 1072, 2 PIN
无铅Yes
欧盟RoHS规范Yes
状态ACTIVE
包装形状矩形的
包装尺寸LONG FORM
表面贴装Yes
端子形式NO 铅
端子涂层NOT SPECIFIED
端子位置END
包装材料陶瓷, 金属-SEALED COFIRED
工艺POSITIVE-INTRINSIC-负
结构单一的
壳体连接隔离
二极管元件材料
最大功耗极限2.5 W
二极管类型PIN二极管
应用开关
频带高 频率 TO ULTRA 高 频率
最大二极管电容0.8000 pF
最大二极管正向电阻0.6000 ohm
少数载流子寿命额定值4.5 us

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MA4P7464F-1072T
Non Magnetic SMQ MELF PIN Diode
Features
Non-Magnetic Package Suitable for MRI
Applications
Rectangular MELF SMQ Ceramic Package
Hermetically Sealed
Low Rs for Low Series Loss
Long
τ
L
for Lower Intermodulation Distortion
Low C
j
for High Series Isolation
High Average Incident Power Handling
RoHS Compliant
V2
Description
The MA4P7464F-1072T is a surface mountable
PIN diode in a non-magnetic,
Metal Electrode
Leadless Faced
(MELF) package. The device
incorporates M/A-COM Technology Solutions
time proven HIPAX technology to produce a low
inductance ceramic package with no ribbons or
whisker wires. Incorporated in the package is a
hard glass passivated, CERMACHIP™ PIN chip
that is full face bonded on both the cathode and
anode to maximize surface area for the lowest
electrical and thermal resistance. The package
utilizes a non-magnetic plating process that
provides for a package with extremely low
permeability. The MA4P7464F-1072T has been
comprehensively characterized both electrically
and mechanically to ensure repeatable and
predictable performance. The non-magnetic
MA4P7464F-1072T is the electrical equivalent of
its magnetic counterpart the MA4P7004F-1072T.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high
volume tape and reel assembly. The rectangular
package design provides for highly efficient
automatic pick and place assembly techniques. The
parallel flat surfaces are suitable for key jaw or
vacuum pickup. All solderable surfaces are tin plated
and compatible with reflow and vapor phase
soldering methods.
Absolute Maximum Ratings
1
@ 25°C
Parameter
Operating Temperature
Storage Temperature
Absolute Maximum
-65 °C to +125°C
-65 °C to +150°C
+175 °C Continuous
+265°C for 10 seconds
+ 50 dBm C.W.
+ 250 mA
l - 400 V l
Applications
This diode is well suited for use in low loss, low
distortion, high power switching circuits and can
be used in high magnetic field environments at HF
through UHF frequencies. The low thermal
resistance of this device provides excellent
performance at high RF power incident levels, up
to 100 watts CW. This device is designed to meet
the most demanding electrical and mechanical
MRI environments.
Diode Junction Temperature
Diode Mounting Temperature
RF C.W. Incident Power
Forward D.C. Current
Reverse D.C. Voltage @ -10uA
1. Exceeding these limits may cause permanent damage.
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.

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