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AS8S128K32Q-35/XT: 产品描述SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68; 产品类别存储存储; 文件大小235KB，共11页; 制造商Micross; 官网地址https://www.micross.com

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AS8S128K32Q-35/XT概述

SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68

AS8S128K32Q-35/XT规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Micross
零件包装代码	QFP
包装说明	QFP, QFP68,.99SQ,50
针数	68
Reach Compliance Code	compliant
ECCN代码	3A001.A.2.C
最长访问时间	35 ns
其他特性	ALSO CONFIGURABLE AS 512K X 8
备用内存宽度	16
I/O 类型	COMMON
JESD-30 代码	S-CQFP-G68
JESD-609代码	e0
长度	22.352 mm
内存密度	4194304 bit
内存集成电路类型	SRAM MODULE
内存宽度	32
功能数量	1
端子数量	68
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	128KX32
输出特性	3-STATE
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QFP
封装等效代码	QFP68,.99SQ,50
封装形状	SQUARE
封装形式	FLATPACK
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
认证状态	Not Qualified
筛选级别	MIL-STD-883
座面最大高度	5.08 mm
最大待机电流	0.006 A
最小待机电流	2 V
最大压摆率	0.52 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	TIN LEAD
端子形式	GULL WING
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	22.352 mm

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SRAM

Austin Semiconductor, Inc.

128K x 32 SRAM

SRAM MEMORY ARRAY

AVAILABLE AS MILITARY

SPECIFICATIONS

• SMD 5962-95595: -Q

• SMD 5962-93187: -P or -PN

• MIL-STD-883

AS8S128K32

PIN ASSIGNMENT

(Top View)

68 Lead CQFP (Q)

FEATURES

• Access times of 15, 17, 20, 25, 35, and 45 ns

• Built in decoupling caps for low noise operation

• Organized as 128K x32; User configured as

256Kx16 or 512K x8

• Operation with single 5 volt supply

• Low power CMOS

• TTL Compatible Inputs and Outputs

• 2V Data Retention, Low power standby

66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)

OPTIONS

•

Timing

15ns

17ns

20ns

25ns

35ns

45ns

Package

Ceramic Quad Flatpack

Pin Grid Array -8 Series

MARKINGS

-15

-17

-20

-25

-35

-45

•

No. 702

No. 802

66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)

NOTE:

PN indicates a no connect on pins 8, 21, 28, 39

GENERAL DESCRIPTION

The Austin Semiconductor, Inc. AS8S128K32 is a 4 Mega-

bit CMOS SRAM Module organized as 128Kx32-bits and user

configurable to 256Kx16 or 512Kx8. The AS8S128K32 achieves

high speed access, low power consumption and high reliability

by employing advanced CMOS memory technology.

The military temperature grade product is suited for mili-

tary applications.

The AS8S128K32 is offered in a ceramic quad flatpack mod-

ule per SMD-5962-95595 with a maximum height of 0.140 inches.

This module makes use of a low profile, mutlichip module de-

sign.

This device is also offered in a 1.075 inch square ceramic

pin grid array per SMD 5692-93187, which has a maximum height

of 0.195 inches. This package is also a low profile, multi-chip

module design reducing height requirements to a minimum.

CE4

WE4

128K x 8

CE3

WE3

128K x 8

I/O 24 - I/O 31

128K x 8

CE2

WE2

I/O 16 - I/O 23

CE1

WE1

A0 - 16

128K x 8

I/O 8 - I/O 23

For more products and information

please visit our web site at

www.austinsemiconductor.com

AS8S128K32

Rev. 3.5 7/00

I/O 0 - I/O 7

Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.

AS8S128K32Q-35/XT相似产品对比

	AS8S128K32Q-35/XT	AS8S128K32Q-25/IT	AS8S128K32Q-17/XT	AS8S128K32Q-20/XT	AS8S128K32Q-25/XT	AS8S128K32Q-17/IT	AS8S128K32Q-35/IT	AS8S128K32Q-20/IT	AS8S128K32Q-45/IT	AS8S128K32Q-45/XT
描述	SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 45ns, CMOS, CQFP68, CERAMIC, QFP-68
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50	QFP, QFP68,.99SQ,50
针数	68	68	68	68	68	68	68	68	68	68
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A001.A.2.C	3A991.B.2.A	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A001.A.2.C
最长访问时间	35 ns	25 ns	17 ns	20 ns	25 ns	17 ns	35 ns	20 ns	45 ns	45 ns
其他特性	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8
备用内存宽度	16	16	16	16	16	16	16	16	16	16
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm
内存密度	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
内存集成电路类型	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
内存宽度	32	32	32	32	32	32	32	32	32	32
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	68	68	68	68	68	68	68	68	68	68
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	85 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C
最低工作温度	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
组织	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
封装等效代码	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
最大待机电流	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A
最小待机电流	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
最大压摆率	0.52 mA	0.56 mA	0.65 mA	0.6 mA	0.56 mA	0.65 mA	0.52 mA	0.6 mA	0.5 mA	0.5 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm
厂商名称	Micross	-	Micross	Micross	Micross	Micross	Micross	Micross	Micross	Micross

AS8S128K32Q-35/XT

AS8S128K32Q-35/XT概述

AS8S128K32Q-35/XT规格参数

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