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RS8228EBGB

产品描述Support Circuit, 1-Func, CMOS, PBGA272, 27 MM, BGA-272
产品类别无线/射频/通信    电信电路   
文件大小1002KB,共183页
制造商Mindspeed Technologies Inc
官网地址https://www.macom.com
下载文档 详细参数 选型对比 全文预览

RS8228EBGB概述

Support Circuit, 1-Func, CMOS, PBGA272, 27 MM, BGA-272

RS8228EBGB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Mindspeed Technologies Inc
零件包装代码BGA
包装说明BGA, BGA272,20X20,50
针数272
Reach Compliance Codecompliant
应用程序ATM
JESD-30 代码S-PBGA-B272
长度27 mm
功能数量1
端子数量272
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA272,20X20,50
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
认证状态Not Qualified
座面最大高度2.54 mm
标称供电电压3.3 V
表面贴装YES
技术CMOS
电信集成电路类型ATM/SONET/SDH SUPPORT CIRCUIT
温度等级INDUSTRIAL
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度27 mm

文档预览

下载PDF文档
RS8228/M28228
Octal ATM Transmission Convergence PHY Device
The RS8228 Octal ATM Transmission Convergence PHY device dramatically improves
performance for switch and access system low-speed ports by integrating all the ATM
physical layer processing functions found in the ATM Forum Cell Based Transmission
Convergence Sublayer specification (af-phy-0043.000) for eight individual ports. Each
port can be independently configured for operation at speeds ranging from 64 kbps to
52 Mbps. There is also a powerdown mode option for each TC port. A UTOPIA Level 2
Multi-PHY interface connects the device to the host switch or terminal system and
concentrates the ATM cell traffic onto one interface.
Typical system implementations center around the concentration of ATM cells over
standard PDH data rates such as T1/E1 lines, DS3/E3 lines, and multiple Digital
Subscriber Line (DSL) formats such as HDSL, ADSL or VDSL*. For each format,
external devices perform the appropriate Physical Media Dependent (PMD) layer
functions and present the RS8228 with a payload bit stream. The RS8228 then performs
all cell alignment functions on that bit stream. This gives system designers a simple,
modular, and low-cost architecture for supporting all UNI and NNI ATM interfaces below
52 Mbps. Because the RS8228 performs only the cell-based portion of the protocol
stack, designers can select the most integrated framer and Line Interface Unit (LIU)
available or reuse existing devices and software.
The RS8228 can also be used in combination with a Conexant Segmentation and
Reassembly (SAR) device. The RS8228 gluelessly connects to the SAR via the UTOPIA
and microprocessor interfaces. The device can be configured and controlled optionally
through a generic microprocessor interface. The RS8228’s chip-select feature allows the
microprocessor to select any of the framers through the PHY. The RS8228’s eight
interrupt inputs provide an internal mechanism for registering and controlling generated
interrupts.
* The term xDSL is used throughout this document to refer to the various DSL
formats as a group.
Distinguishing Features
8 cell-based TC Ports
UTOPIA interface
– Level 2
– 8/16 bit modes
– Multi-PHY
– Redundant channel
Glueless interface to Conexant’s:
– T1/E1 framers
– T3/E3 framers
– HDSL/SDSL devices
– SAR devices
Software reference material provided
8 chip selects for external framers
8 interrupt inputs for external
framers
Octet- and bit-level cell delineation
ITU I.432-compliant
Available in either 27 mm or 17 mm
BGA packages
Functional Block Diagram
Host
RS8228
LCs[7]
LCs[0]
LInt~[7]
LInt~[0]
Interrupt
Status
M
icroprocessor Interface
UTO
PIA
Level 2
M
ulti-PHY
Tx/Rx FIFO
4 Cells
A
TM
Layer
Device
8/16
UTOPIA
Level 2
Interface
External
PM
D
or
Fram
er
Framer
(Line)
Interface
External
PM
D
or
Fram
er
Cell Processor
Line
Interface
P 0
ort
G.804 Cell Fram
er
Cell Processor
Line
Interface
P 7
ort
G.804 Cell Fram
er
Tx/Rx FIFO
4 Cells
Data Sheet
Mindspeed Technologies
500234A

RS8228EBGB相似产品对比

RS8228EBGB M28228 RS8228EBG
描述 Support Circuit, 1-Func, CMOS, PBGA272, 27 MM, BGA-272 Support Circuit, 1-Func, CMOS, PBGA256, 17 MM, BGA-256 Support Circuit, 1-Func, CMOS, PBGA272, 27 MM, BGA-272
厂商名称 Mindspeed Technologies Inc Mindspeed Technologies Inc Mindspeed Technologies Inc
零件包装代码 BGA BGA BGA
包装说明 BGA, BGA272,20X20,50 BGA, BGA256,16X16,40 BGA, BGA272,20X20,50
针数 272 256 272
Reach Compliance Code compliant compliant unknown
应用程序 ATM ATM ATM
JESD-30 代码 S-PBGA-B272 S-PBGA-B256 S-PBGA-B272
长度 27 mm 17 mm 27 mm
功能数量 1 1 1
端子数量 272 256 272
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA
封装等效代码 BGA272,20X20,50 BGA256,16X16,40 BGA272,20X20,50
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
电源 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 2.54 mm 1.97 mm 2.54 mm
标称供电电压 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
电信集成电路类型 ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL
端子节距 1.27 mm 1 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM
宽度 27 mm 17 mm 27 mm
是否Rohs认证 不符合 不符合 -
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED -
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