2.0-18.0 GHz GaAs MMIC
Low Noise Gain Block
September 2005 - Rev 27-Sep-05
CMM1100-BD
Features
Fully matched
Single Supply Voltage (+5V)
Easy assembly
High gain: 17.5dB typical
Low noise figure: 3.3dB typical at 6GHz
Small chip size: 1.60 x 1.55 x 0.076
Absolute Maximum Ratings
(2)
Drain Voltage Supply
Drain Current
Dissipated Power
Input Power
Storage Temperature (Tstg)
Channel Temperature
Operating Backside Temperature
4.5 to 8.0 V
180 mA
1.2 W
10 dBm
-50 to 150 ºC
175 ºC
-40 ºC to
(3)
Circuit Description
Mimix Broadband’s two stage 2-18 GHz low noise amplifier offers a
unique combination of low noise figure and broadband output
match. The device employs a unique feedback stage to provide
good noise figure that does not exist in typical distributed low
noise designs. The device is a self-biased, single supply design
exhibiting 3.5 dB noise figure, 18 dB gain and 16 dBm P1dB. This
MMIC uses Mimix Broadband’s 0.25 um optical etch-stop pHEMT
process
(2) Operation outside any of these limits can cause
permanent damage.
(3) Calculate maximum operating temperature Tmax using
the following formula: Tmax=175-(Pdiss [W] x 54) [°C].
Room temperature specifications at Vdd=5V
1
Parameter
Operating Frequency Band (f )
Output Power at 1dB Compression (P1dB)
P1dB Peak-to-Peak Variation Over Frequency (
Δ
P1dB)
Linear Gain (Glin)
Glin Peak-toPeak Variation Over Frequency (
Δ
Glin)
Output 3rd Order Intercept Point (OIP3) (at 6 GHz)
Output 2nd Order Intercept Point (OIP2) (at 6 GHz)
Noise Figure (NF) (at 6 GHz)
Input Reflection Coefficient (S11)
Output Reflection Coefficient (S22)
Quiescent Current (Idq)
Thermal Resistance (Rth)
Units
GHz
dBm
dBm
dB
dB
dBm
dB
dB
dB
mA
ºC/W
Min.
2.0
15.0
-
16.5
-
-
-
-
-
-
90
-
Typ.
-
16.0
-
18.0
-
25.5
41.0
3.5
-
-
105
54.0
Max.
18.0
-
1.0
-
2.0
-
-
3.8
-10.0
-12.0
120
-
(1) Small-signal data measured on wafer. Power data measured in connectorized fixture.
Specifications over operating temperature: -40 to +85ºC.
Parameter
P1dB Variation from Room Temperature Value (
Δ
P1dB)
Glin Variation from Room Temperature Value (
Δ
Glin)
Units
dBm
dB
Min.
-
-
Typ.
-
-
Max.
0.7
1.0
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 4
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Gain Block
September 2005 - Rev 27-Sep-05
CMM1100-BD
Low Noise Gain Block Measurements
CMM1100BD_5V_110mA
20
19
20
Gain
18
17
16
15
14
5
10
15
Gain ( S21 ) dB
13
12
0
K-Factor
11
10
9
8
7
6
5
4
-20
-15
-5
S11
-10
S22
3
2
1
0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
-30
-25
Frequency (GHz)
CMM1100
Typical Noise Figure Data at 5V
(test fixture)
8.0
CMM1100 [ Typical Power P1dB (in Fixture), Vd=5V, Id=115mA ~ 16 devices
20
7.0
19
18
6.0
17
P1dB (dBm)
5.0
NF (dB)
16
15
14
13
4.0
3.0
12
11
2.0
10
2
1.0
4
6
8
( S11, S22 ) dB
10
Freq (GHz)
12
14
16
18
0.0
0
2
4
6
8
10
Freq (GHz)
12
14
16
18
20
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 4
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Gain Block
September 2005 - Rev 27-Sep-05
CMM1100-BD
Outline and Assembling Scheme
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 4
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-18.0 GHz GaAs MMIC
Low Noise Gain Block
September 2005 - Rev 27-Sep-05
CMM1100-BD
Handling and Assembly Information
CAUTION!
- Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy
- Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix
Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for
surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user. (2) A critical component is any component of a life support device or system whose
failure to perform can be reasonably expected to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
ESD
- Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied
in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-
static workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care,
sharp tweezers.
Die Attachment
- GaAs Products from Mimix Broadband are 0.075 mm (0.003") thick and have vias through to the
backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as
possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are
Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total
die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001
2
thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated
collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere
is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold
Germanium should be avoided). The work station temperature should be 310 C
+
10 C. Exposure to these
-
extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid
excessive thermal shock. Avoidance of air bridges and force impact are critical during placement.
Wire Bonding
- Wire size: 0.7 to 1.0mil in diameter (prestressed); thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding: Stage Temperature: 250C; Bond Tip Temperature: 150C;
Bonding Tip Pressure: 18 to 40 gms depending on size of wire.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 4
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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