DATA SHEET
GaAs MULTI-CHIP MODULE
MC-7891
1 GHz CATV 19 dB POWER DOUBLER AMPLIFIER
DESCRIPTION
The MC-7891 is a GaAs Multi-chip Module designed for use in CATV applications up to 1 GHz. This unit has low
distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low distortion
• High linear gain
• Low return loss
G
L
= 18.5 dB MIN. @ f = 1 GHz
ORDERING INFORMATION
Part Number
MC-7891
Order Number
MC-7891-AZ
Package
7-pin special with heatsink (Pb-Free)
Supplying Form
25 pcs MAX./Tray
Remark
To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7891
ABSOLUTE MAXIMUM RATINGS (T
A
= +25°C, unless otherwise specified)
Parameter
Supply Voltage
Input Voltage
Note
Symbol
V
DD
V
i
T
C
T
stg
Ratings
30
65.0
−30
to +100
−40
to +100
Unit
V
dBmV
°C
°C
Operating Case Temperature
Storage Temperature
Note
In case of single tone
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10673EJ01V0DS (1st edition)
Date Published July 2007 NS
Printed in Japan
2007
MC-7891
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Partial Heating
Soldering Conditions
Peak temperature (pin temperature) : 350°C or below
Soldering time (per pin of device)
Note
For soldering
Recommended Condition Symbol
−
: 3 seconds or less
Note
The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
4
Data Sheet PG10673EJ01V0DS
MC-7891
•
The information in this document is current as of July, 2007. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
•
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written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
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•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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customers or third parties arising from the use of these circuits, software and information.
•
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redundancy, fire-containment and anti-failure features.
•
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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(Note)
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defined above).
M8E 02. 11-1
Data Sheet PG10673EJ01V0DS
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